Adolf Koller

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method with stealth dicing process for fabricating MEMS semiconduct...
- Patent number 11,939,216
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer expander
- Patent number 10,811,297
- Issue date Oct 20, 2020
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier arrangement and method for processing a carrier by generati...
- Patent number 10,748,801
- Issue date Aug 18, 2020
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with circumferential structure and method of m...
- Patent number 10,522,478
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Franco Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detaching semiconductor material from a carrier and devic...
- Patent number 10,460,972
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GMR sensor within molded magnetic material employing non-magnetic s...
- Patent number 10,107,875
- Issue date Oct 23, 2018
- Infineon Technologies AG
- Klaus Elian
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Substrate removal from a carrier
- Patent number 10,043,701
- Issue date Aug 7, 2018
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of a reinforcement ring from a wafer
- Patent number 10,029,913
- Issue date Jul 24, 2018
- Infineon Technologies AG
- Adolf Koller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip comprising a backside metal stack
- Patent number 9,147,624
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip comprising a fill structure
- Patent number 9,040,354
- Issue date May 26, 2015
- Infineon Technologies AG
- Gunther Mackh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Singulation processes
- Patent number 9,040,389
- Issue date May 26, 2015
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor component
- Patent number 8,993,372
- Issue date Mar 31, 2015
- Infineon Technologies Austria AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation of semiconductor devices from a wafer carrier
- Patent number 8,883,565
- Issue date Nov 11, 2014
- Infineon Technologies AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a wafer
- Patent number 8,809,120
- Issue date Aug 19, 2014
- Infineon Technologies AG
- Giuseppe Miccoli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a plurality of chips
- Patent number 8,785,234
- Issue date Jul 22, 2014
- Infineon Technologies AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip comprising a fill structure
- Patent number 8,704,338
- Issue date Apr 22, 2014
- Infineon Technologies AG
- Gunther Mackh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic light emitting device and method for fabricating the same
- Patent number 8,482,019
- Issue date Jul 9, 2013
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,323,996
- Issue date Dec 4, 2012
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor
- Patent number 8,289,019
- Issue date Oct 16, 2012
- Infineon Technologies AG
- Adolf Koller
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor package
- Patent number 8,207,018
- Issue date Jun 26, 2012
- Infineon Technologies AG
- Horst Theuss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel, semiconductor device and method for the production thereof
- Patent number 8,164,173
- Issue date Apr 24, 2012
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 8,017,942
- Issue date Sep 13, 2011
- Infineon Technologies AG
- Franco Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a thin semiconductor chip
- Patent number 7,863,104
- Issue date Jan 4, 2011
- Infineon Technologies AG
- Werner Kroeninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,830,022
- Issue date Nov 9, 2010
- Infineon Technologies AG
- Horst Theuss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Singulating semiconductor wafers to form semiconductor chips
- Patent number 7,799,659
- Issue date Sep 21, 2010
- Infineon Technologies AG
- Klaus Pressel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel, semiconductor device and method for the production thereof
- Patent number 7,772,693
- Issue date Aug 10, 2010
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER, ELECTRONIC COMPONENT AND METHOD USING LASER PENETRATION AFFE...
- Publication number 20230066813
- Publication date Mar 2, 2023
- INFINEON TECHNOLOGIES AG
- Gunther MACKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD WITH STEALTH DICING PROCESS FOR FABRICATING MEMS SEMICONDUCT...
- Publication number 20210309513
- Publication date Oct 7, 2021
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Carrier Arrangement and Method for Processing a Carrier
- Publication number 20180286735
- Publication date Oct 4, 2018
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING THIN WAFER DURING CHIP MANUFACTURE
- Publication number 20180233470
- Publication date Aug 16, 2018
- INFINEON TECHNOLOGIES AG
- Thomas Killer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Circumferential Structure and Method of M...
- Publication number 20180204808
- Publication date Jul 19, 2018
- INFINEON TECHNOLOGIES AG
- Franco Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer expander
- Publication number 20170352572
- Publication date Dec 7, 2017
- INFINEON TECHNOLOGIES AG
- Adolf KOLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF A REINFORCEMENT RING FROM A WAFER
- Publication number 20170349432
- Publication date Dec 7, 2017
- INFINEON TECHNOLOGIES AG
- Adolf Koller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of detaching semiconductor material from a carrier and devic...
- Publication number 20160315012
- Publication date Oct 27, 2016
- INFINEON TECHNOLOGIES AG
- Adolf KOLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Protection Structure
- Publication number 20160211227
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Eva Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Removal from a Carrier
- Publication number 20140338827
- Publication date Nov 20, 2014
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Dicing a Wafer
- Publication number 20140329373
- Publication date Nov 6, 2014
- Giuseppe Miccoli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing a Plurality of Chips
- Publication number 20140284771
- Publication date Sep 25, 2014
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Comprising a Fill Structure
- Publication number 20140170836
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip Having Backside Metal and Method for Manufacturing Same
- Publication number 20140117505
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Singulation Processes
- Publication number 20140099777
- Publication date Apr 10, 2014
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separation of Semiconductor Devices from a Wafer Carrier
- Publication number 20130084658
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Comprising a Fill Structure
- Publication number 20130075869
- Publication date Mar 28, 2013
- INFINEON TECHNOLOGIES AG
- Gunther Mackh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for producing a semiconductor component
- Publication number 20120225544
- Publication date Sep 6, 2012
- Manfred SCHNEEGANS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Dicing a Wafer
- Publication number 20120211748
- Publication date Aug 23, 2012
- INFINEON TECHNOLOGIES AG
- Giuseppe Miccoli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Light Emitting Device and Method for Fabricating the Same
- Publication number 20110180837
- Publication date Jul 28, 2011
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GMR SENSOR WITHIN MOLDED MAGNETIC MATERIAL EMPLOYING NON-MAGNETIC S...
- Publication number 20110127998
- Publication date Jun 2, 2011
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110027942
- Publication date Feb 3, 2011
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Panel, Semiconductor Device and Method for the Production Thereof
- Publication number 20100264523
- Publication date Oct 21, 2010
- Infineon Technologies AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100221854
- Publication date Sep 2, 2010
- INFINEON TECHNOLOGIES AG
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR
- Publication number 20100201356
- Publication date Aug 12, 2010
- INFINEON TECHNOLOGIES AG
- Adolf Koller
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20100127355
- Publication date May 27, 2010
- INFINEON TECHNOLOGIES AG
- Franco Mariani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20090102054
- Publication date Apr 23, 2009
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of Producing a Thin Semiconductor Chip
- Publication number 20090098684
- Publication date Apr 16, 2009
- INFINEON TECHNOLOGIES AG
- Werner Kroeninger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panel, semiconductor device and method for the production thereof
- Publication number 20080191359
- Publication date Aug 14, 2008
- Adolf Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATING SEMICONDUCTOR WAFERS TO FORM SEMICONDUCTOR CHIPS
- Publication number 20070293020
- Publication date Dec 20, 2007
- INFINEON TECHNOLOGIES AG
- Klaus Pressel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Adolf Koller

Person

Patents Grantslast 30 patents

Method with stealth dicing process for fabricating MEMS semiconduct...

Wafer expander

Carrier arrangement and method for processing a carrier by generati...

Semiconductor device with circumferential structure and method of m...

Method of detaching semiconductor material from a carrier and devic...

GMR sensor within molded magnetic material employing non-magnetic s...

Substrate removal from a carrier

Removal of a reinforcement ring from a wafer

Chip comprising a backside metal stack

Chip comprising a fill structure

Singulation processes

Method for producing a semiconductor component

Separation of semiconductor devices from a wafer carrier

Method of dicing a wafer

Method for manufacturing a plurality of chips

Chip comprising a fill structure

Electronic light emitting device and method for fabricating the same

Semiconductor device

Sensor

Semiconductor package

Panel, semiconductor device and method for the production thereof

Semiconductor device and method

Method of producing a thin semiconductor chip

Semiconductor package

Singulating semiconductor wafers to form semiconductor chips

Panel, semiconductor device and method for the production thereof

Patents Applicationslast 30 patents

WAFER, ELECTRONIC COMPONENT AND METHOD USING LASER PENETRATION AFFE...

METHOD WITH STEALTH DICING PROCESS FOR FABRICATING MEMS SEMICONDUCT...

Carrier Arrangement and Method for Processing a Carrier

HANDLING THIN WAFER DURING CHIP MANUFACTURE

Semiconductor Device with Circumferential Structure and Method of M...

Wafer expander

REMOVAL OF A REINFORCEMENT RING FROM A WAFER

Method of detaching semiconductor material from a carrier and devic...

Semiconductor Device Including a Protection Structure

Substrate Removal from a Carrier

Method of Dicing a Wafer

Method for Manufacturing a Plurality of Chips

Chip Comprising a Fill Structure

Chip Having Backside Metal and Method for Manufacturing Same

Singulation Processes

Separation of Semiconductor Devices from a Wafer Carrier

Chip Comprising a Fill Structure

Method for producing a semiconductor component

Method of Dicing a Wafer

Electronic Light Emitting Device and Method for Fabricating the Same

GMR SENSOR WITHIN MOLDED MAGNETIC MATERIAL EMPLOYING NON-MAGNETIC S...

SEMICONDUCTOR PACKAGE

Panel, Semiconductor Device and Method for the Production Thereof

SEMICONDUCTOR DEVICE

SENSOR

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR PACKAGE

Method of Producing a Thin Semiconductor Chip

Panel, semiconductor device and method for the production thereof

SINGULATING SEMICONDUCTOR WAFERS TO FORM SEMICONDUCTOR CHIPS