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Tsing Yi, HK
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Patents Grants
last 30 patents
Information
Patent Grant
Leadless integrated circuit package having standoff contacts and di...
Patent number
9,305,889
Issue date
Apr 5, 2016
UTAC Hong Kong Limited
Kirk Powell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless array plastic package with various IC packaging configurat...
Patent number
8,828,801
Issue date
Sep 9, 2014
UTAC Hong Kong Limited
John McMillan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless integrated circuit package having standoff contacts and di...
Patent number
8,736,037
Issue date
May 27, 2014
UTAC Hong Kong Limited
Kirk Powell
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DI...
Publication number
20140367865
Publication date
Dec 18, 2014
UTAC Hong Kong Limited
Kirk POWELL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADLESS ARRAY PLASTIC PACKAGE WITH VARIOUS IC PACKAGING CONFIGURAT...
Publication number
20130273692
Publication date
Oct 17, 2013
John MCMILLAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DI...
Publication number
20100224972
Publication date
Sep 9, 2010
Kirk POWELL
H01 - BASIC ELECTRIC ELEMENTS