Adrian Arcedera

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,908,755
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 11,572,269
- Issue date Feb 7, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,505,452
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded vibration management system having an array of vibration a...
- Patent number 10,861,798
- Issue date Dec 8, 2020
- Amkor Technology, Inc.
- Bora Baloglu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with multiple compartments
- Patent number 10,843,918
- Issue date Nov 24, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 10,822,226
- Issue date Nov 3, 2020
- Amkor Technology, Inc.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with multiple compartments
- Patent number 10,221,064
- Issue date Mar 5, 2019
- Amkor Technology, Inc.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded vibration management system
- Patent number 10,032,726
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multiple compartments
- Patent number 9,932,221
- Issue date Apr 3, 2018
- Amkor Technology, Inc.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat spreader package
- Patent number 8,441,120
- Issue date May 14, 2013
- Amkor Technology, Inc.
- Adrian Arcedera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader package and method
- Patent number 7,999,371
- Issue date Aug 16, 2011
- Amkor Technology, Inc.
- Adrian Arcedera
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240194544
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240175772
- Publication date May 30, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Lawrence NATAN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20230257257
- Publication date Aug 17, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220415733
- Publication date Dec 29, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Kwang Seok Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...
- Publication number 20210265225
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210047173
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20210047172
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS
- Publication number 20190276306
- Publication date Sep 12, 2019
- Amkor Technology, Inc.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20190152770
- Publication date May 23, 2019
- Amkor Technology, Inc.
- YungWoo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED VIBRATION MANAGEMENT SYSTEM
- Publication number 20180374800
- Publication date Dec 27, 2018
- Amkor Technology, Inc.
- Bora Baloglu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS
- Publication number 20180251369
- Publication date Sep 6, 2018
- Amkor Technology, Inc.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20160221820
- Publication date Aug 4, 2016
- Amkor Technology, Inc.
- YungWoo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Adrian Arcedera

Person

Patents Grantslast 30 patents

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor package using a polymer substrate

Semiconductor device

Embedded vibration management system having an array of vibration a...

Semiconductor package with multiple compartments

Semiconductor package using a polymer substrate

Semiconductor package with multiple compartments

Embedded vibration management system

Semiconductor package with multiple compartments

Heat spreader package

Heat spreader package and method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR D...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

EMBEDDED VIBRATION MANAGEMENT SYSTEM

SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE