Adrian LIS

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Lead adapters for semiconductor package
- Patent number 12,113,000
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Ajay Poonjal Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including recesses to contain solder
- Patent number 12,062,589
- Issue date Aug 13, 2024
- Infineon Technologies AG
- Adrian Lis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BARRIER STRUCTURE FOR POWER MODULES
- Publication number 20240413118
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Peter Scherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING A MULTI-LEVEL LEAD FRAME
- Publication number 20240304527
- Publication date Sep 12, 2024
- INFINEON TECHNOLOGIES AG
- Dominic Raithel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING VERTICALLY ALIGNED FIRST AND SECOND SUBSTRATES
- Publication number 20240047429
- Publication date Feb 8, 2024
- INFINEON TECHNOLOGIES AG
- Adrian Lis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH POWER ELECTRONICS CARRIER HAVING TRENCH...
- Publication number 20230245968
- Publication date Aug 3, 2023
- INFINEON TECHNOLOGIES AG
- Peter Scherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIV...
- Publication number 20230223312
- Publication date Jul 13, 2023
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Adapters for Semiconductor Package
- Publication number 20230178460
- Publication date Jun 8, 2023
- Ajay Poonjal Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STOP FEATURE FOR ELECTRONIC DEVICES
- Publication number 20230170316
- Publication date Jun 1, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH RIVET OR PRESS FIT PIN AND METHOD F...
- Publication number 20230054812
- Publication date Feb 23, 2023
- Ajay Poonjal Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING RECESSES TO CONTAIN SOLDER
- Publication number 20220415745
- Publication date Dec 29, 2022
- INFINEON TECHNOLOGIES AG
- Adrian LIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH SHAPED EXTERNAL CONTACT FOR REDUCED CRACK...
- Publication number 20220415732
- Publication date Dec 29, 2022
- Christoph Liebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH PAD HAVING OPEN NOTCH
- Publication number 20220102299
- Publication date Mar 31, 2022
- INFINEON TECHNOLOGIES AG
- Adrian LIS
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Lead adapters for semiconductor package

Semiconductor packages including recesses to contain solder

Patents Applicationslast 30 patents

SOLDER BARRIER STRUCTURE FOR POWER MODULES

POWER MODULE HAVING A MULTI-LEVEL LEAD FRAME

POWER MODULE HAVING VERTICALLY ALIGNED FIRST AND SECOND SUBSTRATES

SEMICONDUCTOR PACKAGE WITH POWER ELECTRONICS CARRIER HAVING TRENCH...

SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIV...

Lead Adapters for Semiconductor Package

SOLDER STOP FEATURE FOR ELECTRONIC DEVICES

POWER SEMICONDUCTOR MODULE WITH RIVET OR PRESS FIT PIN AND METHOD F...

SEMICONDUCTOR PACKAGES INCLUDING RECESSES TO CONTAIN SOLDER

SEMICONDUCTOR MODULE WITH SHAPED EXTERNAL CONTACT FOR REDUCED CRACK...

PACKAGE WITH PAD HAVING OPEN NOTCH