Adwait Telang

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Beaverton, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure comprising fine pitch backside metal redistr...
- Patent number 9,716,066
- Issue date Jul 25, 2017
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES
- Publication number 20240222283
- Publication date Jul 4, 2024
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE COMPRISING FINE PITCH BACKSIDE METAL REDISTR...
- Publication number 20160049371
- Publication date Feb 18, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS