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Ae-nee JANG

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240274499
    • Publication date Aug 15, 2024
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20240170458
    • Publication date May 23, 2024
    • Samsung Electronics Co., Ltd.
    • Min Seung Ji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240153886
    • Publication date May 9, 2024
    • Samsung Electronics Co., Ltd.
    • Haseob Seong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240096717
    • Publication date Mar 21, 2024
    • Samsung Electronics Co., Ltd.
    • AE-NEE JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES
    • Publication number 20240055372
    • Publication date Feb 15, 2024
    • Samsung Electronics Co., Ltd.
    • Ae-Nee Jang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230282538
    • Publication date Sep 7, 2023
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20230197469
    • Publication date Jun 22, 2023
    • Samsung Electronics Co., Ltd.
    • Seokhyun Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEM-IN-PACKAGE MODULE
    • Publication number 20220328454
    • Publication date Oct 13, 2022
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED SEMICONDUCTOR PACKAGE
    • Publication number 20220208730
    • Publication date Jun 30, 2022
    • Samsung Electronics Co., Ltd.
    • AE-NEE JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20220208743
    • Publication date Jun 30, 2022
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME
    • Publication number 20220149013
    • Publication date May 12, 2022
    • Samsung Electronics Co., Ltd.
    • AE-NEE JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20220130685
    • Publication date Apr 28, 2022
    • Samsung Electronics Co., Ltd.
    • Seokhyun Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220068756
    • Publication date Mar 3, 2022
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210296200
    • Publication date Sep 23, 2021
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210233897
    • Publication date Jul 29, 2021
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210183801
    • Publication date Jun 17, 2021
    • Samsung Electronics Co., Ltd.
    • Ae-nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE INCLUDING A HEAT RADIATION STRUCTURE
    • Publication number 20210183724
    • Publication date Jun 17, 2021
    • Samsung Electronics Co., Ltd.
    • SHLE-GE LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    • Publication number 20210143109
    • Publication date May 13, 2021
    • Samsung Electronics Co., Ltd.
    • Yun Rae Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEM-IN-PACKAGE MODULE
    • Publication number 20210118848
    • Publication date Apr 22, 2021
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME
    • Publication number 20200411484
    • Publication date Dec 31, 2020
    • Samsung Electronics Co., Ltd.
    • AE-NEE JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE, METHOD OF TESTING SEMICONDUCTOR DEVICE AND ME...
    • Publication number 20200144138
    • Publication date May 7, 2020
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20200126882
    • Publication date Apr 23, 2020
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    • Publication number 20200126930
    • Publication date Apr 23, 2020
    • Samsung Electronics Co., Ltd.
    • Yun Rae Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
    • Publication number 20200051932
    • Publication date Feb 13, 2020
    • Samsung Electronics Co., Ltd.
    • SEUNG HUN HAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20200035649
    • Publication date Jan 30, 2020
    • Samsung Electronics Co., Ltd.
    • Ae-nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20190164922
    • Publication date May 30, 2019
    • Samsung Electronics Co., Ltd.
    • Ae-nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20170179062
    • Publication date Jun 22, 2017
    • Samsung Electronics Co., Ltd.
    • Ae-nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICES WITH REDISTRIBUTION PADS
    • Publication number 20170084559
    • Publication date Mar 23, 2017
    • Samsung Electronics Co., Ltd.
    • Myeong Soon Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20160086924
    • Publication date Mar 24, 2016
    • Chul-yong JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20160086931
    • Publication date Mar 24, 2016
    • Chul-yong JANG
    • H01 - BASIC ELECTRIC ELEMENTS