Afshin Dadvand

Person

Durham, NC, US

People

Patents Applicationslast 30 patents

Information Patent Application
Multifunctional Adhesion Promoter for Semiconductor Device Packages
- Publication number 20250122413
- Publication date Apr 17, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Direct Bonded Semiconductor Die Package
- Publication number 20250125231
- Publication date Apr 17, 2025
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Bonding
- Publication number 20250105196
- Publication date Mar 27, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038056
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submounts with Stud Protrusions for Semiconductor Packages
- Publication number 20250038055
- Publication date Jan 30, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Attach Fillet Height Reduction
- Publication number 20240421044
- Publication date Dec 19, 2024
- Wolfspeed, Inc.
- Daniel Ginn Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Devices Including Beryllium Metallization
- Publication number 20240355738
- Publication date Oct 24, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES I...
- Publication number 20240321663
- Publication date Sep 26, 2024
- Afshin DADVAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-COAT MATERIAL CONFIGURED TO ENHANCE DEVICE RELIABILITY AND DEVI...
- Publication number 20240321659
- Publication date Sep 26, 2024
- WOLFSPEED. INC.
- Afshin DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal Nitride Core-Shell Particle Die-Attach Material
- Publication number 20240282741
- Publication date Aug 22, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Die-Attach Process for Semiconductor Packaging
- Publication number 20240274514
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...
- Publication number 20240258217
- Publication date Aug 1, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Core-Shell Particle Die-Attach Material
- Publication number 20240182757
- Publication date Jun 6, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Afshin Dadvand

Person

Patents Applicationslast 30 patents

Multifunctional Adhesion Promoter for Semiconductor Device Packages

Direct Bonded Semiconductor Die Package

Semiconductor Die Bonding

Submounts with Stud Protrusions for Semiconductor Packages

Submounts with Stud Protrusions for Semiconductor Packages

Die-Attach Fillet Height Reduction

Power Semiconductor Devices Including Beryllium Metallization

HIGH-PERFORMANCE STRESS BUFFER DIE-COAT AND DEVICES AND PROCESSES I...

DIE-COAT MATERIAL CONFIGURED TO ENHANCE DEVICE RELIABILITY AND DEVI...

Metal Nitride Core-Shell Particle Die-Attach Material

Electroless Die-Attach Process for Semiconductor Packaging

SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...

Core-Shell Particle Die-Attach Material