Agnieszka WITCZAK

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Berlin, DE

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Patents Grantslast 30 patents

Information Patent Grant
Imidazoyl urea polymers and their use in metal or metal alloy plati...
- Patent number 11,066,553
- Issue date Jul 20, 2021
- Atotech Deutschland GmbH
- Heiko Brunner
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Aqueous copper plating baths and a method for deposition of copper...
- Patent number 10,767,275
- Issue date Sep 8, 2020
- Atotech Deutschland GmbH
- Heiko Brunner
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper plating bath composition
- Patent number 9,551,080
- Issue date Jan 24, 2017
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
IMIDAZOYL UREA POLYMERS AND THEIR USE IN METAL OR METAL ALLOY PLATI...
- Publication number 20190144667
- Publication date May 16, 2019
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AQUEOUS COPPER PLATING BATHS AND A METHOD FOR DEPOSITION OF COPPER...
- Publication number 20180223442
- Publication date Aug 9, 2018
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER PLATING BATH COMPOSITION
- Publication number 20150299883
- Publication date Oct 22, 2015
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR