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Melaka, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Universal clamping mechanism
Patent number
7,181,835
Issue date
Feb 27, 2007
National Semiconductor Corporation
Ah Lek Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced solder joint strength and ease of inspection of leadless l...
Patent number
7,023,074
Issue date
Apr 4, 2006
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced solder joint strength and ease of inspection of leadless l...
Patent number
6,872,599
Issue date
Mar 29, 2005
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Universal clamping mechanism
Patent number
6,698,088
Issue date
Mar 2, 2004
National Semiconductor Corporation
Ah Lek Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Locking lead tips and die attach pad for a leadless package apparat...
Patent number
6,686,652
Issue date
Feb 3, 2004
National Semiconductor
Jaime Bayan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rotary mechanical buffing method for deflashing of molded integrate...
Patent number
6,629,880
Issue date
Oct 7, 2003
National Semiconductor Corporation
Aik Seng Kang
B24 - GRINDING POLISHING
Information
Patent Grant
Cooling for singulation of composite materials in molded semiconduc...
Patent number
6,467,278
Issue date
Oct 22, 2002
National Semiconductor Corporation
Ah Lek Hu
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Low inductance leadless package
Patent number
6,452,255
Issue date
Sep 17, 2002
National Semiconductor, Corp.
Jaime Bayan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical isolation in panels of leadless IC packages
Patent number
6,399,415
Issue date
Jun 4, 2002
National Semiconductor Corporation
Jaime Bayan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Enhanced solder joint strength and ease of inspection of leadless l...
Publication number
20050116321
Publication date
Jun 2, 2005
National Semiconductor Corporation, A Delaware Corp.
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Universal clamping mechanism
Publication number
20040143962
Publication date
Jul 29, 2004
National Semiconductor Corporation
Ah Lek Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Universal clamping mechanism
Publication number
20020100163
Publication date
Aug 1, 2002
National Semiconductor Corporation
Ah Lek Hu
H01 - BASIC ELECTRIC ELEMENTS