Ahmed Nur Amin

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Fairfax, VA, US

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Patents Grantslast 30 patents

Information Patent Grant
Soldering method and related device for improved resistance to brit...
- Patent number 8,242,378
- Issue date Aug 14, 2012
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit chip assembly having array of thermally conducti...
- Patent number 7,982,307
- Issue date Jul 19, 2011
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making electronic entities
- Patent number 7,724,359
- Issue date May 25, 2010
- Agere Systems Inc.
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packages
- Patent number 7,671,436
- Issue date Mar 2, 2010
- Agere Systems Inc.
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRIT...
- Publication number 20120280023
- Publication date Nov 8, 2012
- LSI Corporation
- Ahmed Amin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING
- Publication number 20100319967
- Publication date Dec 23, 2010
- Agere Systems Inc.
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Method and Related Device for Improved Resistance to Brit...
- Publication number 20100243300
- Publication date Sep 30, 2010
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making electronic entities
- Publication number 20090298286
- Publication date Dec 3, 2009
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic packages
- Publication number 20090273078
- Publication date Nov 5, 2009
- Ahmed Nur Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip Chip Assembly Having Improved Thermal Dissipation
- Publication number 20080116567
- Publication date May 22, 2008
- Ahmed Amin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR