Ai Chie Wang

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
- Patent number 11,189,548
- Issue date Nov 30, 2021
- Micron Technology, Inc.
- Ai-Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
- Patent number 9,721,874
- Issue date Aug 1, 2017
- Micron Technology, Inc.
- Ai Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
- Patent number 8,357,566
- Issue date Jan 22, 2013
- Micron Technology, Inc.
- Ai-Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 8,283,761
- Issue date Oct 9, 2012
- Micron Technology, Inc.
- Teck Kheng Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 7,968,376
- Issue date Jun 28, 2011
- Micron Technology, Inc.
- Teck Kheng Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Packaged microelectronic devices with a lead frame
- Patent number 7,612,436
- Issue date Nov 3, 2009
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, A...
- Publication number 20170288177
- Publication date Oct 5, 2017
- Micron Technology, Inc.
- Ai Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, A...
- Publication number 20130127027
- Publication date May 23, 2013
- Micron Technology, Inc.
- Ai Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20110254144
- Publication date Oct 20, 2011
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20100029043
- Publication date Feb 4, 2010
- Micron Technology, Inc.
- Teck Kheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-encapsulated lead frames for microelectronic device packages, a...
- Publication number 20080048301
- Publication date Feb 28, 2008
- Micron Technology, Inc.
- Ai-Chie Wang
- H01 - BASIC ELECTRIC ELEMENTS