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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed circuit board with shallow solder pad
- Patent number 9,392,693
- Issue date Jul 12, 2016
- Shunsin Technology (Zhong Shan) Limited
- Ai-Hua Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD WITH SHALLOW SOLDER PAD AND METHOD FOR MANUFA...
- Publication number 20140326485
- Publication date Nov 6, 2014
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- AI-HUA LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR