Ai Min Tan

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
System and method for an electronic package with a fail-open mechanism
- Patent number 8,816,390
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Carlo Baterna Marbella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetically alignable integrated circuit device
- Patent number 7,994,608
- Issue date Aug 9, 2011
- Infineon Technologies AG
- Ai Min Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with flip chip contacts and a passivation layer...
- Patent number 7,768,137
- Issue date Aug 3, 2010
- Infineon Technologies AG
- Gerald Ofner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for heatspreader attachment in high thermal pe...
- Patent number 6,351,032
- Issue date Feb 26, 2002
- National Semiconductor Corporation
- Bernard K H Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR AN ELECTRONIC PACKAGE WITH A FAIL-OPEN MECHANISM
- Publication number 20130194752
- Publication date Aug 1, 2013
- INFINEON TECHNOLOGIES AG
- Carlo Baterna Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetically Alignable Integrated Circuit Device
- Publication number 20080265367
- Publication date Oct 30, 2008
- INFINEON TECHNOLOGIES AG
- Ai Min Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip with flip chip contacts, and method for producin...
- Publication number 20060270163
- Publication date Nov 30, 2006
- Gerald Ofner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Attachment of flip chips to substrates
- Publication number 20060115927
- Publication date Jun 1, 2006
- Infineon Technologies AG
- Swain Hong Alfred Yeo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR