AI SEN LIU

Person

MIAOLI COUNTY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting diode packaging structure and method for fabricating...
- Patent number 11,769,861
- Issue date Sep 26, 2023
- Ingentec Corporation
- Ai Sen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment module for transferring a magnetic light-emitting die and...
- Patent number 11,508,872
- Issue date Nov 22, 2022
- Ingentec Corporation
- Ai Sen Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20240339579
- Publication date Oct 10, 2024
- INGENTEC CORPORATION
- Ai-Sen LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION PROCESS METHOD FOR WAFER-LEVEL LIGHT-EMITTING DIODE DIES
- Publication number 20240304749
- Publication date Sep 12, 2024
- INGENTEC CORPORATION
- Ai-Sen LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIODE AND LASER DIODE MANUFACTURING METHOD
- Publication number 20240178631
- Publication date May 30, 2024
- INGENTEC CORPORATION
- Ai-Sen LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-FILLING METHOD OF THROUGH-GLASS VIA SUBSTRATE
- Publication number 20240071872
- Publication date Feb 29, 2024
- INGENTEC CORPORATION
- Hsiao Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND TRANSFERRING METHOD FOR DIE PACKAGE STRUCTURES
- Publication number 20240072033
- Publication date Feb 29, 2024
- INGENTEC CORPORATION
- Hsiao Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Light Emitting Diode Die Packaging Method
- Publication number 20240072013
- Publication date Feb 29, 2024
- INGENTEC CORPORATION
- HSIAO LU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...
- Publication number 20240006557
- Publication date Jan 4, 2024
- INGENTEC CORPORATION
- Yi-Chuan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...
- Publication number 20240008170
- Publication date Jan 4, 2024
- INGENTEC CORPORATION
- Yi-Chuan HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC LED DIE TRANSFERRING DEVICE AND MAGNETIC LED DIE TRANSFERR...
- Publication number 20230369296
- Publication date Nov 16, 2023
- INGENTEC CORPORATION
- Ai-Sen LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL LIGHT-EMITTING DIODE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230170434
- Publication date Jun 1, 2023
- INGENTEC CORPORATION
- AI SEN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE PACKAGING STRUCTURE AND METHOD FOR FABRICATING...
- Publication number 20220271200
- Publication date Aug 25, 2022
- INGENTEC CORPORATION
- AI SEN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MODULE FOR TRANSFERRING A MAGNETIC LIGHT-EMITTING DIE AND...
- Publication number 20220190196
- Publication date Jun 16, 2022
- INGENTEC CORPORATION
- AI SEN LIU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

LED circuit board structure and LED testing and packaging method

Light-emitting diode packaging structure and method for fabricating...

Alignment module for transferring a magnetic light-emitting die and...

Patents Applicationslast 30 patents

LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...

ENCAPSULATION PROCESS METHOD FOR WAFER-LEVEL LIGHT-EMITTING DIODE DIES

LASER DIODE AND LASER DIODE MANUFACTURING METHOD

VIA-FILLING METHOD OF THROUGH-GLASS VIA SUBSTRATE

BONDING AND TRANSFERRING METHOD FOR DIE PACKAGE STRUCTURES

Vertical Light Emitting Diode Die Packaging Method

LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...

LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...

MAGNETIC LED DIE TRANSFERRING DEVICE AND MAGNETIC LED DIE TRANSFERR...

VERTICAL LIGHT-EMITTING DIODE AND METHOD FOR FABRICATING THE SAME

LIGHT-EMITTING DIODE PACKAGING STRUCTURE AND METHOD FOR FABRICATING...

ALIGNMENT MODULE FOR TRANSFERRING A MAGNETIC LIGHT-EMITTING DIE AND...