Ai Wen WANG

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Monolithic surface mount passive component
- Patent number 12,142,402
- Issue date Nov 12, 2024
- SanDisk Technologies, Inc.
- Ai-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumped pad structure
- Patent number 11,557,555
- Issue date Jan 17, 2023
- Western Digital Technologies, Inc.
- Hsiao Jung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...
- Publication number 20240120317
- Publication date Apr 11, 2024
- Western Digital Technologies, Inc.
- Cheng-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SURFACE MOUNT PASSIVE COMPONENT
- Publication number 20220399306
- Publication date Dec 15, 2022
- Western Digital Technologies, Inc.
- Ai-Wen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPED PAD STRUCTURE
- Publication number 20210391286
- Publication date Dec 16, 2021
- Western Digital Technologies, Inc.
- Hsiao Jung LIN
- H01 - BASIC ELECTRIC ELEMENTS