Aik Chong Tan

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Johor Bahru, MY

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Patents Grantslast 30 patents

Information Patent Grant
Bump chip lead frame and package
- Patent number 6,864,423
- Issue date Mar 8, 2005
- Semiconductor Component Industries, L.L.C.
- Aik Chong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for assembly for thin small outline plastic encapsulated...
- Patent number 6,392,288
- Issue date May 21, 2002
- Semiconductor Components Industries LLC
- Aik Chong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for forming same
- Patent number 6,376,266
- Issue date Apr 23, 2002
- Semiconductor Components Industries LLC
- James Price Letterman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bump chip lead frame and package
- Publication number 20020074147
- Publication date Jun 20, 2002
- Semiconductor Components Industries, LLC.
- Aik Chong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR ASSEMBLY FOR THIN SMALL OUTLINE PLASTIC ENCAPSULATED...
- Publication number 20020066943
- Publication date Jun 6, 2002
- Semiconductor Components Industries, LLC.
- Aik Chong Tan
- H01 - BASIC ELECTRIC ELEMENTS