Aiko Hirata

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Saitama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electrically conductive paste
- Patent number 11,270,810
- Issue date Mar 8, 2022
- Dowa Electronics Materials Co., Ltd.
- Aiko Hirata
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Silver-coated copper powder and method for producing same
- Patent number 10,580,910
- Issue date Mar 3, 2020
- Dowa Electronics Materials Co., Ltd.
- Hiroshi Kamiga
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 10,008,471
- Issue date Jun 26, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE
- Publication number 20200118703
- Publication date Apr 16, 2020
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Aiko Hirata
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SILVER-COATED COPPER POWDER AND METHOD FOR PRODUCING SAME
- Publication number 20190027620
- Publication date Jan 24, 2019
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Hiroshi Kamiga
- B22 - CASTING POWDER METALLURGY