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Okayama, JP
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last 30 patents
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Patent Grant
Bonding material and bonding method using the same
Patent number
9,240,256
Issue date
Jan 19, 2016
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Bonding material using metal nanoparticles coated with C6-C8 fatty...
Patent number
8,858,700
Issue date
Oct 14, 2014
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Low-temperature-sinterable bonding material, and bonding method usi...
Patent number
8,641,929
Issue date
Feb 4, 2014
Dowa Electronics Materials Co., Ltd.
Keiichi Endoh
B82 - NANO-TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
Publication number
20160172328
Publication date
Jun 16, 2016
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi ENDOH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
Publication number
20160099087
Publication date
Apr 7, 2016
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi ENDOH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USI...
Publication number
20130081759
Publication date
Apr 4, 2013
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B82 - NANO-TECHNOLOGY
Information
Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
Publication number
20120298009
Publication date
Nov 29, 2012
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING MATERIAL USING METAL NANOPARTICLES AND BONDING METHOD
Publication number
20120103515
Publication date
May 3, 2012
DOWA ELECTRONICS MATERIALS CO., LTD.
Keiichi Endoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR