Aipeng Shu

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device grid array package
- Patent number 9,252,114
- Issue date Feb 2, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with pre-molded die
- Patent number 9,214,413
- Issue date Dec 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE
- Publication number 20150243623
- Publication date Aug 27, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH PRE-MOLDED DIE
- Publication number 20150243586
- Publication date Aug 27, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE HELIX SUBSTRATE AND THREE-DIMENSIONAL PACKAGE WITH SAME
- Publication number 20140284805
- Publication date Sep 25, 2014
- Huan Wang
- H01 - BASIC ELECTRIC ELEMENTS