Aiying XU

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Multi-die molded substrate integrated circuit device
- Patent number 7,670,866
- Issue date Mar 2, 2010
- Intel Corporation
- Haixiao Sun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-DIE MOLDED SUBSTRATE INTEGRATED CIRCUIT DEVICE
- Publication number 20080277781
- Publication date Nov 13, 2008
- Haixiao SUN
- H01 - BASIC ELECTRIC ELEMENTS