Aizou Kaneda

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,781,896
- Issue date Aug 24, 2010
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
- Patent number 7,560,307
- Issue date Jul 14, 2009
- Hitachi Chemical Company, Ltd.
- Yasuhiro Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,387,914
- Issue date Jun 17, 2008
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,078,094
- Issue date Jul 18, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
- Patent number 7,061,081
- Issue date Jun 13, 2006
- Hitachi Chemical Co., Ltd.
- Yasuhiro Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,057,265
- Issue date Jun 6, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,012,320
- Issue date Mar 14, 2006
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 6,855,579
- Issue date Feb 15, 2005
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating method of film-shaped organic die-bonding material, die-...
- Patent number 6,825,249
- Issue date Nov 30, 2004
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 6,717,242
- Issue date Apr 6, 2004
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,611,064
- Issue date Aug 26, 2003
- Hitachi Chemical Company, Ltd.
- Takashi Kousaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste composition, and protective film and semiconductor device bot...
- Patent number 6,404,068
- Issue date Jun 11, 2002
- Hitachi Chemical Company, Ltd.
- Toshiaki Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of production of semiconductor device
- Patent number 6,223,429
- Issue date May 1, 2001
- Hitachi Chemical Company, Ltd.
- Aizou Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating method of film-shaped organic die-bonding material, die-...
- Patent number 6,099,678
- Issue date Aug 8, 2000
- Hitachi Chemical Company Ltd.
- Akio Kotato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF
- Publication number 20080290529
- Publication date Nov 27, 2008
- HITACHI CHEMICAL CO., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
- Publication number 20060180908
- Publication date Aug 17, 2006
- Yasuhiro Yano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF
- Publication number 20060180903
- Publication date Aug 17, 2006
- HITACHI CHEMICAL CO., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20040253770
- Publication date Dec 16, 2004
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20030160337
- Publication date Aug 28, 2003
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
- Publication number 20030082925
- Publication date May 1, 2003
- Yasuhiro Yano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010035533
- Publication date Nov 1, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010016384
- Publication date Aug 23, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010009780
- Publication date Jul 26, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS

Aizou Kaneda

Person

Patents Grantslast 30 patents

Semiconductor device and process for fabrication thereof

Resin composition, heat-resistant resin paste and semiconductor dev...

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Resin composition, heat-resistant resin paste and semiconductor dev...

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Laminating method of film-shaped organic die-bonding material, die-...

Semiconductor device and process for fabrication thereof

Semiconductor device and method for manufacturing the same

Paste composition, and protective film and semiconductor device bot...

Method of production of semiconductor device

Laminating method of film-shaped organic die-bonding material, die-...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

Resin composition, heat-resistant resin paste and semiconductor dev...

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Resin composition, heat-resistant resin paste and semiconductor dev...

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof