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Ajay Jain
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Hillsboro, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Rounded metal trace corner for stress reduction
Patent number
11,784,150
Issue date
Oct 10, 2023
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnect structures configured for manufacturing a...
Patent number
11,387,188
Issue date
Jul 12, 2022
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rounded metal trace corner for stress reduction
Patent number
11,380,643
Issue date
Jul 5, 2022
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnect structures configured for manufacturing a...
Patent number
10,867,926
Issue date
Dec 15, 2020
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnect structures configured for manufacturing a...
Patent number
10,833,020
Issue date
Nov 10, 2020
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rounded metal trace corner for stress reduction
Patent number
10,797,014
Issue date
Oct 6, 2020
Intel Corporation
Dae-Woo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device of preventing delamination of semiconductor layers
Patent number
8,143,158
Issue date
Mar 27, 2012
Intel Corporation
Ajay Jain
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Methodology to introduce metal and via openings
Patent number
6,641,982
Issue date
Nov 4, 2003
Intel Corporation
Ajay Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methodology to introduce metal and via openings
Patent number
6,579,666
Issue date
Jun 17, 2003
Intel Corportion
Ajay Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making a semiconductor device having copper conductive l...
Patent number
6,522,000
Issue date
Feb 18, 2003
Intel Corporation
Ajay Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for making a semiconductor device having copper conductive l...
Patent number
6,455,426
Issue date
Sep 24, 2002
Intel Corporation
Ajay Jain
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ROUNDED METAL TRACE CORNER FOR STRESS REDUCTION
Publication number
20220285306
Publication date
Sep 8, 2022
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECT STRUCTURES CONFIGURED FOR MANUFACTURING A...
Publication number
20210057345
Publication date
Feb 25, 2021
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUNDED METAL TRACE CORNER FOR STRESS REDUCTION
Publication number
20200402940
Publication date
Dec 24, 2020
Intel Corporation
Dae-Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECT STRUCTURES CONFIGURED FOR MANUFACTURING A...
Publication number
20200168553
Publication date
May 28, 2020
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECT STRUCTURES CONFIGURED FOR MANUFACTURING A...
Publication number
20190252322
Publication date
Aug 15, 2019
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUNDED METAL TRACE CORNER FOR STRESS REDUCTION
Publication number
20190157232
Publication date
May 23, 2019
Intel Corporation
Dae-Wood Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND DEVICE OF PREVENTING DELAMINATION OF SEMICONDUCTOR LAYERS
Publication number
20100276788
Publication date
Nov 4, 2010
Ajay Jain
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Method for making a semiconductor device having copper conductive l...
Publication number
20030032271
Publication date
Feb 13, 2003
Ajay Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methodology to introduce metal and via openings
Publication number
20020081531
Publication date
Jun 27, 2002
Ajay Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methodology to introduce metal and via openings
Publication number
20020081532
Publication date
Jun 27, 2002
Ajay Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for making a semiconductor device having copper conductive l...
Publication number
20020076928
Publication date
Jun 20, 2002
Ajay Jain
H01 - BASIC ELECTRIC ELEMENTS