Ajay Kumar

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 11,621,194
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using hybrid laser scribing and plasma etch approach w...
- Patent number 11,355,394
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer dicing approach using a split beam laser scribing proc...
- Patent number 11,217,536
- Issue date Jan 4, 2022
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-absorbing mask for hybrid laser scribing and plasma etch wafe...
- Patent number 11,158,540
- Issue date Oct 26, 2021
- Applied Materials, Inc.
- Wenguang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,910,271
- Issue date Feb 2, 2021
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,714,390
- Issue date Jul 14, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mitigation of particle contamination for wafer dicing processes
- Patent number 10,661,383
- Issue date May 26, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,566,238
- Issue date Feb 18, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a multiple pass laser scribing p...
- Patent number 10,535,561
- Issue date Jan 14, 2020
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mitigation of particle contamination for wafer dicing processes
- Patent number 10,363,629
- Issue date Jul 30, 2019
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for improving CD micro-loading in photomask plasma etching
- Patent number 10,199,224
- Issue date Feb 5, 2019
- Applied Materials, Inc.
- Zhigang Mao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for dry etch with edge, side and back protection
- Patent number 10,170,277
- Issue date Jan 1, 2019
- Applied Materials, Inc.
- Saravjeet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor having an array of plural individually controlled ga...
- Patent number 10,170,280
- Issue date Jan 1, 2019
- Applied Materials, Inc.
- Madhavi R. Chandrachood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 10,163,713
- Issue date Dec 25, 2018
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wafer dicing approach using a split beam laser scribing proc...
- Patent number 9,972,575
- Issue date May 15, 2018
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for controlling photoresist line width roughn...
- Patent number 9,911,582
- Issue date Mar 6, 2018
- Applied Materials, Inc.
- Banqiu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer dicing approach using a rotating beam laser scribing p...
- Patent number 9,852,997
- Issue date Dec 26, 2017
- Applied Materials, Inc.
- Jungrae Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etch mask for hybrid laser scribing and plasma etch wafer singulati...
- Patent number 9,793,132
- Issue date Oct 17, 2017
- Applied Materials, Inc.
- Wenguang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer coating
- Patent number 9,768,014
- Issue date Sep 19, 2017
- Applied Materials, Inc.
- Jungrae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrodes for etch
- Patent number 9,754,765
- Issue date Sep 5, 2017
- Applied Materials, Inc.
- Banqiu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch-resistant water soluble mask for hybrid wafer dicing using las...
- Patent number 9,721,839
- Issue date Aug 1, 2017
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer mask including non-photodefinable laser energy absorbin...
- Patent number 9,620,379
- Issue date Apr 11, 2017
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
UV-cure pre-treatment of carrier film for wafer dicing using hybrid...
- Patent number 9,601,375
- Issue date Mar 21, 2017
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water soluble mask formation by dry film lamination
- Patent number 9,583,375
- Issue date Feb 28, 2017
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for dicing wafers having thick passivation pol...
- Patent number 9,460,966
- Issue date Oct 4, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water soluble mask formation by dry film vacuum lamination for lase...
- Patent number 9,443,765
- Issue date Sep 13, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving CD micro-loading in photomask plasma etching
- Patent number 9,425,062
- Issue date Aug 23, 2016
- Applied Materials, Inc.
- Zhigang Mao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of outgassing a mask material deposited over a workpiece in...
- Patent number 9,412,619
- Issue date Aug 9, 2016
- Applied Materials, Inc.
- Prabhat Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid wafer dicing approach using a line shaped laser beam profile...
- Patent number 9,355,907
- Issue date May 31, 2016
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20230207393
- Publication date Jun 29, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20210134676
- Publication date May 6, 2021
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20200286787
- Publication date Sep 10, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20200118880
- Publication date Apr 16, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH W...
- Publication number 20200091001
- Publication date Mar 19, 2020
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATION OF PARTICLE CONTAMINATION FOR WAFER DICING PROCESSES
- Publication number 20190291206
- Publication date Sep 26, 2019
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING A MULTIPLE PASS LASER SCRIBING P...
- Publication number 20190279902
- Publication date Sep 12, 2019
- Applied Materials, Inc.
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR DRY ETCH WITH EDGE, SIDE AND BACK PROTECTION
- Publication number 20190096634
- Publication date Mar 28, 2019
- Applied Materials, Inc.
- Saravjeet SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20190088549
- Publication date Mar 21, 2019
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MITIGATION OF PARTICLE CONTAMINATION FOR WAFER DICING PROCESSES
- Publication number 20180345418
- Publication date Dec 6, 2018
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-ABSORBING MASK FOR HYBRID LASER SCRIBING AND PLASMA ETCH WAFE...
- Publication number 20180342422
- Publication date Nov 29, 2018
- Applied Materials, Inc.
- Wenguang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROC...
- Publication number 20180226355
- Publication date Aug 9, 2018
- Applied Materials, Inc.
- JUNGRAE PARK
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
HYBRID WAFER DICING APPROACH USING A ROTATING BEAM LASER SCRIBING P...
- Publication number 20170278801
- Publication date Sep 28, 2017
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROC...
- Publication number 20170256500
- Publication date Sep 7, 2017
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCH-RESISTANT WATER SOLUBLE MASK FOR HYBRID WAFER DICING USING LAS...
- Publication number 20160365283
- Publication date Dec 15, 2016
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING CD MICRO-LOADING IN PHOTOMASK PLASMA ETCHING
- Publication number 20160329210
- Publication date Nov 10, 2016
- Applied Materials, Inc.
- Zhigang MAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UV-CURE PRE-TREATMENT OF CARRIER FILM FOR WAFER DICING USING HYBRID...
- Publication number 20160315009
- Publication date Oct 27, 2016
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER DICING APPROACH USING A POLYGON SCANNING-BASED LASER S...
- Publication number 20160197015
- Publication date Jul 7, 2016
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC ION RADICAL SIEVE AND ION RADICAL APERTURE FOR AN INDUCTIVE...
- Publication number 20160181067
- Publication date Jun 23, 2016
- Applied Materials, Inc.
- Saravjeet SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20160141210
- Publication date May 19, 2016
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...
- Publication number 20160133519
- Publication date May 12, 2016
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY CONTACT COVER RING FOR PLASMA DICING
- Publication number 20160086852
- Publication date Mar 24, 2016
- James M. Holden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER DICING APPROACH USING AN ADAPTIVE OPTICS-CONTROLLED LA...
- Publication number 20160086851
- Publication date Mar 24, 2016
- Jungrae PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR CONTROLLING PHOTORESIST LINE WIDTH ROUGHN...
- Publication number 20160064197
- Publication date Mar 3, 2016
- Applied Materials, Inc.
- Banqiu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF OUTGASSING A MASK MATERIAL DEPOSITED OVER A WORKPIECE IN...
- Publication number 20160049313
- Publication date Feb 18, 2016
- Applied Materials, Inc.
- PRABHAT KUMAR
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PLASMA REACTOR HAVING AN ARRAY OF PLURAL INDIVIDUALLY CONTROLLED GA...
- Publication number 20160042917
- Publication date Feb 11, 2016
- Applied Materials, Inc.
- Madhavi R. Chandrachood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER MASK INCLUDING NON-PHOTODEFINABLE LASER ENERGY ABSORBIN...
- Publication number 20160035577
- Publication date Feb 4, 2016
- Applied Materials, Inc.
- Wei-Sheng LEI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID WAFER DICING APPROACH USING A RECTANGULAR SHAPED TWO-DIMENSI...
- Publication number 20160027697
- Publication date Jan 28, 2016
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH THERMALLY RESISTANT FILM FRAME FOR SUPPORTING WAFER DU...
- Publication number 20150332970
- Publication date Nov 19, 2015
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE WARP SUPPRESSION FOR THIN WAFER SUPPORTED BY TAPE FRAME
- Publication number 20150311107
- Publication date Oct 29, 2015
- Wei-Sheng Lei
- B32 - LAYERED PRODUCTS

Person

Patents Grantslast 30 patents

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using hybrid laser scribing and plasma etch approach w...

Hybrid wafer dicing approach using a split beam laser scribing proc...

Light-absorbing mask for hybrid laser scribing and plasma etch wafe...

Wafer dicing using femtosecond-based laser and plasma etch

Wafer dicing using femtosecond-based laser and plasma etch

Mitigation of particle contamination for wafer dicing processes

Wafer dicing using femtosecond-based laser and plasma etch

Hybrid wafer dicing approach using a multiple pass laser scribing p...

Mitigation of particle contamination for wafer dicing processes

Method for improving CD micro-loading in photomask plasma etching

Apparatus and methods for dry etch with edge, side and back protection

Plasma reactor having an array of plural individually controlled ga...

Wafer dicing using femtosecond-based laser and plasma etch

Hybrid wafer dicing approach using a split beam laser scribing proc...

Methods and apparatus for controlling photoresist line width roughn...

Hybrid wafer dicing approach using a rotating beam laser scribing p...

Etch mask for hybrid laser scribing and plasma etch wafer singulati...

Wafer coating

Electrodes for etch

Etch-resistant water soluble mask for hybrid wafer dicing using las...

Multi-layer mask including non-photodefinable laser energy absorbin...

UV-cure pre-treatment of carrier film for wafer dicing using hybrid...

Water soluble mask formation by dry film lamination

Method and apparatus for dicing wafers having thick passivation pol...

Water soluble mask formation by dry film vacuum lamination for lase...

Method for improving CD micro-loading in photomask plasma etching

Method of outgassing a mask material deposited over a workpiece in...

Hybrid wafer dicing approach using a line shaped laser beam profile...

Patents Applicationslast 30 patents

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH W...

MITIGATION OF PARTICLE CONTAMINATION FOR WAFER DICING PROCESSES

HYBRID WAFER DICING APPROACH USING A MULTIPLE PASS LASER SCRIBING P...

APPARATUS AND METHODS FOR DRY ETCH WITH EDGE, SIDE AND BACK PROTECTION

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

MITIGATION OF PARTICLE CONTAMINATION FOR WAFER DICING PROCESSES

LIGHT-ABSORBING MASK FOR HYBRID LASER SCRIBING AND PLASMA ETCH WAFE...

HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROC...

HYBRID WAFER DICING APPROACH USING A ROTATING BEAM LASER SCRIBING P...

HYBRID WAFER DICING APPROACH USING A SPLIT BEAM LASER SCRIBING PROC...

ETCH-RESISTANT WATER SOLUBLE MASK FOR HYBRID WAFER DICING USING LAS...

METHOD FOR IMPROVING CD MICRO-LOADING IN PHOTOMASK PLASMA ETCHING

UV-CURE PRE-TREATMENT OF CARRIER FILM FOR WAFER DICING USING HYBRID...

HYBRID WAFER DICING APPROACH USING A POLYGON SCANNING-BASED LASER S...

DYNAMIC ION RADICAL SIEVE AND ION RADICAL APERTURE FOR AN INDUCTIVE...

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGUL...

PROXIMITY CONTACT COVER RING FOR PLASMA DICING

HYBRID WAFER DICING APPROACH USING AN ADAPTIVE OPTICS-CONTROLLED LA...

METHODS AND APPARATUS FOR CONTROLLING PHOTORESIST LINE WIDTH ROUGHN...

METHOD OF OUTGASSING A MASK MATERIAL DEPOSITED OVER A WORKPIECE IN...

PLASMA REACTOR HAVING AN ARRAY OF PLURAL INDIVIDUALLY CONTROLLED GA...

MULTI-LAYER MASK INCLUDING NON-PHOTODEFINABLE LASER ENERGY ABSORBIN...

HYBRID WAFER DICING APPROACH USING A RECTANGULAR SHAPED TWO-DIMENSI...

CARRIER WITH THERMALLY RESISTANT FILM FRAME FOR SUPPORTING WAFER DU...

WAFER EDGE WARP SUPPRESSION FOR THIN WAFER SUPPORTED BY TAPE FRAME