Ajay P. Giri

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnections for flip-chip using lead-free solders and having i...
- Patent number 8,314,500
- Issue date Nov 20, 2012
- Ultratech, Inc.
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of UBM and solder bumps and methods of fabrication
- Patent number 8,003,512
- Issue date Aug 23, 2011
- International Business Machines Corporation
- Luc L. Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection for flip-chip using lead-free solders and having im...
- Patent number 7,932,169
- Issue date Apr 26, 2011
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a multichip module having chips on two sides
- Patent number 6,973,715
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Ajay Prabhakar Giri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling local current to achieve uniform plating thi...
- Patent number 6,896,784
- Issue date May 24, 2005
- International Business Machines Corporation
- Tien-Jen Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for controlling local current to achieve unifo...
- Patent number 6,890,413
- Issue date May 10, 2005
- International Business Machines Corporation
- Tien-Jen Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multichip module having chips on two sides
- Patent number 6,765,152
- Issue date Jul 20, 2004
- International Business Machines Corporation
- Ajay Prabhakar Giri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming a multi-level thin-film electronic packaging st...
- Patent number 6,678,949
- Issue date Jan 20, 2004
- International Business Machines Corporation
- Chandrika Prasad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method using a thin adhesion promoting layer for bonding silicone e...
- Patent number 6,451,155
- Issue date Sep 17, 2002
- International Business Machines Corporation
- Hilton T. Toy
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Structure and process for making substrate packages for high freque...
- Patent number 6,291,272
- Issue date Sep 18, 2001
- International Business Machines Corporation
- Ajay P. Giri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level thin-film electronic packaging structure and related me...
- Patent number 6,281,452
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct deposit thin film single/multi chip module
- Patent number 6,261,467
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Ajay P. Giri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion-resistant terminal metal pads for thin film packages
- Patent number 6,235,412
- Issue date May 22, 2001
- International Business Machines Corporation
- Tien-Jen Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for producing corrosion-resistant terminal metal pads for t...
- Patent number 6,083,375
- Issue date Jul 4, 2000
- International Business Machines Corporation
- Tien-Jen Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Direct deposit thin film single/multi chip module
- Patent number 6,037,044
- Issue date Mar 14, 2000
- International Business Machines Corporation
- Ajay P. Giri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion promoting layer for bonding polymeric adhesive to metal an...
- Patent number 5,931,222
- Issue date Aug 3, 1999
- International Business Machines Coporation
- Hilton T. Toy
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for forming thin film capacitors
- Patent number 5,912,044
- Issue date Jun 15, 1999
- International Business Machines Corporation
- Mukta Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser exposure of photosensitive polyimide for pattern formation
- Patent number 5,370,974
- Issue date Dec 6, 1994
- International Business Machines Corporation
- Peter A. Agostino
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for fabricating a low dielectric composite substrate
- Patent number 5,277,725
- Issue date Jan 11, 1994
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Spin on oxygen reactive ion etch barrier
- Patent number 5,270,151
- Issue date Dec 14, 1993
- International Business Machines Corporation
- Peter A. Agostino
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for fabricating a low dielectric composite substrate
- Patent number 5,135,595
- Issue date Aug 4, 1992
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION
- Publication number 20100193949
- Publication date Aug 5, 2010
- International Business Machines Corporation
- Luc L. Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection for flip-chip using lead-free solders and having im...
- Publication number 20100062597
- Publication date Mar 11, 2010
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...
- Publication number 20080157395
- Publication date Jul 3, 2008
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrolytic method for photoresist stripping
- Publication number 20050167284
- Publication date Aug 4, 2005
- International Business Machines Corporation
- Ajay P. Giri
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for controlling local current to achieve unifo...
- Publication number 20040226826
- Publication date Nov 18, 2004
- International Business Machines Incorporation
- Tien-Jen Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Multichip module having chips on two sides
- Publication number 20040118601
- Publication date Jun 24, 2004
- Ajay Prabhakar Giri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR CONTROLLING LOCAL CURRENT TO ACHIEVE UNIFO...
- Publication number 20040115932
- Publication date Jun 17, 2004
- International Business Machines Corporation
- Tien-Jen Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Multichip module having chips on two sides
- Publication number 20040060732
- Publication date Apr 1, 2004
- International Business Machines Corporation
- Ajay Prabhakar Giri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for forming a multi-level thin-film electronic packaging st...
- Publication number 20010037565
- Publication date Nov 8, 2001
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS

Ajay P. Giri

Person

Patents Grantslast 30 patents

Interconnections for flip-chip using lead-free solders and having i...

Structure of UBM and solder bumps and methods of fabrication

Interconnection for flip-chip using lead-free solders and having im...

Method of forming a multichip module having chips on two sides

Method for controlling local current to achieve uniform plating thi...

Method and apparatus for controlling local current to achieve unifo...

Multichip module having chips on two sides

Process for forming a multi-level thin-film electronic packaging st...

Method using a thin adhesion promoting layer for bonding silicone e...

Structure and process for making substrate packages for high freque...

Multi-level thin-film electronic packaging structure and related me...

Direct deposit thin film single/multi chip module

Corrosion-resistant terminal metal pads for thin film packages

Process for producing corrosion-resistant terminal metal pads for t...

Direct deposit thin film single/multi chip module

Adhesion promoting layer for bonding polymeric adhesive to metal an...

Method for forming thin film capacitors

Laser exposure of photosensitive polyimide for pattern formation

Process for fabricating a low dielectric composite substrate

Spin on oxygen reactive ion etch barrier

Process for fabricating a low dielectric composite substrate

Patents Applicationslast 30 patents

NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION

Interconnection for flip-chip using lead-free solders and having im...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING I...

Electrolytic method for photoresist stripping

Method and apparatus for controlling local current to achieve unifo...

Multichip module having chips on two sides

METHOD AND APPARATUS FOR CONTROLLING LOCAL CURRENT TO ACHIEVE UNIFO...

Multichip module having chips on two sides

Process for forming a multi-level thin-film electronic packaging st...