Ajibola O. Ibidunni

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Litchfield, NH, US

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Patents Grantslast 30 patents

Information Patent Grant
Metallization for polymer-dielectric multichip modules
- Patent number 5,622,895
- Issue date Apr 22, 1997
- Lucent Technologies Inc.
- Aaron L. Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization for polymer-dielectric multichip modules including a...
- Patent number 5,466,972
- Issue date Nov 14, 1995
- AT&T Corp.
- Aaron L. Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-based metallizations for hybrid integrated circuits
- Patent number 5,356,526
- Issue date Oct 18, 1994
- AT&T Bell Laboratories
- Robert P. Frankenthal
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper-based metallizations for hybrid integrated circuits
- Patent number 5,288,951
- Issue date Feb 22, 1994
- AT&T Bell Laboratories
- Robert P. Frankenthal
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR