Ajit V. Sathe

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package having bottom-side stiffener
- Patent number 8,952,511
- Issue date Feb 10, 2015
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple-dice packages using elements between dice to control appli...
- Patent number 7,589,395
- Issue date Sep 15, 2009
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reworkable thermal interface material
- Patent number 7,253,523
- Issue date Aug 7, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless electronics packaging and methods of manufacture
- Patent number 7,159,313
- Issue date Jan 9, 2007
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat spreader and stiffener having a stiffener extension
- Patent number 7,045,890
- Issue date May 16, 2006
- Intel Corporation
- Hong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangements to provide mechanical stiffening elements to a thin-co...
- Patent number 6,903,278
- Issue date Jun 7, 2005
- Intel Corporation
- Ajit V. Sathe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless electronics packaging
- Patent number 6,840,777
- Issue date Jan 11, 2005
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible tape electronics packaging
- Patent number 6,800,947
- Issue date Oct 5, 2004
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package design with improved power delivery performance
- Patent number 6,703,697
- Issue date Mar 9, 2004
- Intel Corporation
- Anne Leahy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Patent number 6,661,660
- Issue date Dec 9, 2003
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Patent number 6,639,799
- Issue date Oct 28, 2003
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct heatpipe attachment to die using center point loading
- Patent number 6,625,022
- Issue date Sep 23, 2003
- Intel Corporation
- Kris Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having a heat pipe that conducts heat from a se...
- Patent number 6,535,386
- Issue date Mar 18, 2003
- Intel Corporation
- Ajit V. Sathe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Direct heatpipe attachment to die using center point loading
- Patent number 6,469,893
- Issue date Oct 22, 2002
- Intel Corporation
- Kris Frutschy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTIPLE SOCKET CONCEPT
- Publication number 20130005162
- Publication date Jan 3, 2013
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING BOTTOM-SIDE STIFFENER
- Publication number 20090152738
- Publication date Jun 18, 2009
- Ajit V. Sathe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTIPLE-DICE PACKAGES WITH CONTROLLED UNDERFILL AND METHODS OF MAN...
- Publication number 20080001310
- Publication date Jan 3, 2008
- Ajit V. Sathe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
System and method for securing mobile equipment
- Publication number 20050287986
- Publication date Dec 29, 2005
- Ajit V. Sathe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Solderless electronics packaging and methods of manufacture
- Publication number 20050091844
- Publication date May 5, 2005
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reworkable thermal interface material
- Publication number 20050027055
- Publication date Feb 3, 2005
- Intel Corporation
- Ashay A. Dani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Flexible tape electronics packaging and methods of manufacture
- Publication number 20050017345
- Publication date Jan 27, 2005
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package design with improved power delivery performance
- Publication number 20030110452
- Publication date Jun 12, 2003
- Anne Leahy
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Arrangements to increase structural rigidity of semiconductor package
- Publication number 20030062618
- Publication date Apr 3, 2003
- Hong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangements to provide mechanical stiffening elements to a thin-co...
- Publication number 20030000736
- Publication date Jan 2, 2003
- Ajit V. Sathe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible tape electronics packaging
- Publication number 20030001287
- Publication date Jan 2, 2003
- Intel Corporation
- Ajit V. Sathe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Publication number 20020080583
- Publication date Jun 27, 2002
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Publication number 20020080584
- Publication date Jun 27, 2002
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly having a heat pipe that conducts heat from a se...
- Publication number 20020067598
- Publication date Jun 6, 2002
- Ajit V. Sathe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Solderless electronics packaging and methods of manufacture
- Publication number 20020065965
- Publication date May 30, 2002
- Intel Corporation
- Ajit V. Sathe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct heatpipe attachment to die using center point loading
- Publication number 20020051341
- Publication date May 2, 2002
- Kris Frutschy
- H01 - BASIC ELECTRIC ELEMENTS

Ajit V. Sathe

Person

Patents Grantslast 30 patents

Integrated circuit package having bottom-side stiffener

Multiple-dice packages using elements between dice to control appli...

Reworkable thermal interface material

Solderless electronics packaging and methods of manufacture

Heat spreader and stiffener having a stiffener extension

Arrangements to provide mechanical stiffening elements to a thin-co...

Solderless electronics packaging

Flexible tape electronics packaging

Electronic package design with improved power delivery performance

Integrated vapor chamber heat sink and spreader and an embedded dir...

Integrated vapor chamber heat sink and spreader and an embedded dir...

Direct heatpipe attachment to die using center point loading

Electronic assembly having a heat pipe that conducts heat from a se...

Direct heatpipe attachment to die using center point loading

Patents Applicationslast 30 patents

MULTIPLE SOCKET CONCEPT

INTEGRATED CIRCUIT PACKAGE HAVING BOTTOM-SIDE STIFFENER

MULTIPLE-DICE PACKAGES WITH CONTROLLED UNDERFILL AND METHODS OF MAN...

System and method for securing mobile equipment

Solderless electronics packaging and methods of manufacture

Reworkable thermal interface material

Flexible tape electronics packaging and methods of manufacture

Electronic package design with improved power delivery performance

Arrangements to increase structural rigidity of semiconductor package

Arrangements to provide mechanical stiffening elements to a thin-co...

Flexible tape electronics packaging

Integrated vapor chamber heat sink and spreader and an embedded dir...

Integrated vapor chamber heat sink and spreader and an embedded dir...

Electronic assembly having a heat pipe that conducts heat from a se...

Solderless electronics packaging and methods of manufacture

Direct heatpipe attachment to die using center point loading