Akhilesh P. Rallabandi

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods, apparatus, and systems to dynamically schedule workloads a...
- Patent number 11,972,303
- Issue date Apr 30, 2024
- Intel Corporation
- Carin Ruiz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid backside thermal structures for enhanced IC packages
- Patent number 11,948,906
- Issue date Apr 2, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Segmented heatsink
- Patent number 11,251,103
- Issue date Feb 15, 2022
- Intel Corporation
- Jerrod Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for thermal management of device under test (DUT)
- Patent number 10,281,521
- Issue date May 7, 2019
- Intel Corporation
- David Won-jun Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICES, METHODS, AND SYSTEMS OF A SELF-SANITIZING LAPTOP
- Publication number 20240390541
- Publication date Nov 28, 2024
- Intel Corporation
- Smit KAPILA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
- Publication number 20240203926
- Publication date Jun 20, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHASSIS CUSTOMIZATION WITH HIGH THROUGHPUT ADDITIVE MANUFACTURED MO...
- Publication number 20230317556
- Publication date Oct 5, 2023
- Intel Corporation
- Akhilesh Rallabandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVELY MANUFACTURED HEAT DISSIPATION DEVICE
- Publication number 20230266070
- Publication date Aug 24, 2023
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COOLING SYSTEMS AND COOLERS FOR ELECTRONIC DEVICES
- Publication number 20220214730
- Publication date Jul 7, 2022
- Intel Corporation
- Arturo Navarro Alvarez
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUB-AMBIENT COOLING SYSTEM WITH CONDENSATION CONTROL FOR USE WITH E...
- Publication number 20210329811
- Publication date Oct 21, 2021
- Intel Corporation
- Mark MacDonald
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES
- Publication number 20210249375
- Publication date Aug 12, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS HEAT PIPES
- Publication number 20210059073
- Publication date Feb 25, 2021
- Intel Corporation
- Gaurav Patankar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOELECTRIC COOLING SYSTEM WITH SUB-AMBIENT COOLING AND CONDENSA...
- Publication number 20200363104
- Publication date Nov 19, 2020
- Intel Corporation
- Mark MacDonald
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS, APPARATUS, AND SYSTEMS TO DYNAMICALLY SCHEDULE WORKLOADS A...
- Publication number 20200326994
- Publication date Oct 15, 2020
- Intel Corporation
- Carin Ruiz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEGMENTED HEATSINK
- Publication number 20190252286
- Publication date Aug 15, 2019
- Intel Corporation
- Jerrod Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR THERMAL MANAGEMENT OF DEVICE UNDER TEST (DUT)
- Publication number 20180156863
- Publication date Jun 7, 2018
- Intel Corporation
- David Won-jun Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Akhilesh P. Rallabandi

Person

Patents Grantslast 30 patents

Methods, apparatus, and systems to dynamically schedule workloads a...

Hybrid backside thermal structures for enhanced IC packages

Segmented heatsink

System for thermal management of device under test (DUT)

Patents Applicationslast 30 patents

DEVICES, METHODS, AND SYSTEMS OF A SELF-SANITIZING LAPTOP

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

CHASSIS CUSTOMIZATION WITH HIGH THROUGHPUT ADDITIVE MANUFACTURED MO...

ADDITIVELY MANUFACTURED HEAT DISSIPATION DEVICE

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

LIQUID COOLING SYSTEMS AND COOLERS FOR ELECTRONIC DEVICES

SUB-AMBIENT COOLING SYSTEM WITH CONDENSATION CONTROL FOR USE WITH E...

HYBRID BACKSIDE THERMAL STRUCTURES FOR ENHANCED IC PACKAGES

HETEROGENEOUS HEAT PIPES

THERMOELECTRIC COOLING SYSTEM WITH SUB-AMBIENT COOLING AND CONDENSA...

METHODS, APPARATUS, AND SYSTEMS TO DYNAMICALLY SCHEDULE WORKLOADS A...

SEGMENTED HEATSINK

SYSTEM FOR THERMAL MANAGEMENT OF DEVICE UNDER TEST (DUT)