Aki Hidaka

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Miyazaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Water-soluble cutting fluid for slicing silicon ingots
- Patent number 9,522,481
- Issue date Dec 20, 2016
- Sanyo Chemical Industries, Ltd.
- Aki Hidaka
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
WATER-SOLUBLE CUTTING FLUID FOR SLICING SILICON INGOTS
- Publication number 20120156123
- Publication date Jun 21, 2012
- SANYO CHEMICAL INDUSTRIES, LTD.
- Aki Hidaka
- B28 - WORKING CEMENT, CLAY, OR STONE