TREA

Aki Koukami

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  • Osaka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Laminate and electronic device
    • Patent number 11,798,863
    • Issue date Oct 24, 2023
    • Sekisui Chemical Co., Ltd.
    • Kouji Ashiba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Heat dissipation structure
    • Patent number 10,356,946
    • Issue date Jul 16, 2019
    • Kaneka Corporation
    • Keisuke Oguma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Heat dissipating structure
    • Patent number 9,826,623
    • Issue date Nov 21, 2017
    • Kaneka Corporation
    • Aki Koukami
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    LAMINATE AND ELECTRONIC DEVICE
    • Publication number 20200388551
    • Publication date Dec 10, 2020
    • Sekisui Chemical Co., Ltd
    • Kouji ASHIBA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC TERMINAL EQUIPMENT AND METHOD FOR ASSEMBLING SAME
    • Publication number 20170090532
    • Publication date Mar 30, 2017
    • Kaneka Corporation
    • Aki Koukami
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    HEAT DISSIPATING STRUCTURE
    • Publication number 20160157334
    • Publication date Jun 2, 2016
    • Kaneka Corporation
    • Aki KOUKAMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT DISSIPATION STRUCTURE
    • Publication number 20150351217
    • Publication date Dec 3, 2015
    • Kaneka Corporation
    • Aki KOUKAMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT DISSIPATION STRUCTURE
    • Publication number 20150163958
    • Publication date Jun 11, 2015
    • Kaneka Corporation
    • Keisuke Oguma
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL