TREA

Aki Takahashi

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer processing method
    • Patent number 8,029,335
    • Issue date Oct 4, 2011
    • Disco Corporation
    • Aki Takahashi
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

  • Information Patent Application

    WORKPIECE GRINDING METHOD
    • Publication number 20230398654
    • Publication date Dec 14, 2023
    • Disco Corporation
    • Aki TAKAHASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VEHICLE WINDOW STRUCTURE
    • Publication number 20230086792
    • Publication date Mar 23, 2023
    • AGC Inc.
    • Takayuki KIMURA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20090186563
    • Publication date Jul 23, 2009
    • Disco Corporation
    • Aki Takahashi
    • B24 - GRINDING POLISHING
  • Information Patent Application

    Call-arrival signaling method
    • Publication number 20020094069
    • Publication date Jul 18, 2002
    • Aki Takahashi
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE