Akie Hamasaki

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Die-sorting sheet and method for transporting chips having adhesive...
- Patent number 8,587,130
- Issue date Nov 19, 2013
- Lintec Corporation
- Akie Hamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Marking method and sheet for both protective film forming and dicing
- Patent number 7,935,574
- Issue date May 3, 2011
- Lintec Corporation
- Naoya Saiki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Die-Sorting Sheet and Method for Transporting Chips Having Adhesive...
- Publication number 20100311226
- Publication date Dec 9, 2010
- LINTEC CORPORATION
- Akie Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Marking method and sheet for both protective film forming and dicing
- Publication number 20060102987
- Publication date May 18, 2006
- LINTEC CORPORATION
- Naoya Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hardenable pressure-sensitive adhesive sheet for semiconductor and...
- Publication number 20050208296
- Publication date Sep 22, 2005
- LINTEC CORPORATION
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...