Akihiko Endo

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing bonded wafer
- Patent number 8,802,540
- Issue date Aug 12, 2014
- Sumco Corporation
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial wafer and production method thereof
- Patent number 8,330,222
- Issue date Dec 11, 2012
- Sumco Corporation
- Yoshiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor substrate
- Patent number 8,183,133
- Issue date May 22, 2012
- Sumco Corporation
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial wafer and production method thereof
- Patent number 8,173,553
- Issue date May 8, 2012
- Sumco Corporation
- Yoshiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor wafer by forming a strain rel...
- Patent number 8,110,486
- Issue date Feb 7, 2012
- Sumco Corporation
- Koji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer and method for producing bonded wafer
- Patent number 8,048,767
- Issue date Nov 1, 2011
- Sumco Corporation
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 8,048,769
- Issue date Nov 1, 2011
- Sumco Corporation
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a bonded wafer
- Patent number 8,003,494
- Issue date Aug 23, 2011
- SUMCO Corporation
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling film thinning of semiconductor wafer for soli...
- Patent number 7,960,225
- Issue date Jun 14, 2011
- Sumco Corporation
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor substrate having an SOI structure
- Patent number 7,951,692
- Issue date May 31, 2011
- Sumco Corporation
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded silicon wafer
- Patent number 7,927,957
- Issue date Apr 19, 2011
- SUMCO Corporation
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 7,927,972
- Issue date Apr 19, 2011
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing bonded wafer
- Patent number 7,902,043
- Issue date Mar 8, 2011
- Sumco Corporation
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 7,867,877
- Issue date Jan 11, 2011
- Sumco Corporation
- Etsuro Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated substrate manufacturing method and laminated substrate ma...
- Patent number 7,858,494
- Issue date Dec 28, 2010
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded wafer
- Patent number 7,855,132
- Issue date Dec 21, 2010
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor substrate
- Patent number 7,851,337
- Issue date Dec 14, 2010
- Sumco Corporation
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor substrate having an SOI structure
- Patent number 7,795,117
- Issue date Sep 14, 2010
- Sumco Corporation
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing SOI substrate and process for regeneration of...
- Patent number 7,790,573
- Issue date Sep 7, 2010
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded wafer
- Patent number 7,767,549
- Issue date Aug 3, 2010
- Sumco Corporation
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for regenerating layer transferred wafer
- Patent number 7,763,541
- Issue date Jul 27, 2010
- Sumco Corporation
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on insulator substrate and method for manufacturing the same
- Patent number 7,736,998
- Issue date Jun 15, 2010
- Sumco Corporation
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 7,718,509
- Issue date May 18, 2010
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafer and its manufacturing method
- Patent number 7,713,838
- Issue date May 11, 2010
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 7,713,842
- Issue date May 11, 2010
- Sumco Corporation
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 7,625,808
- Issue date Dec 1, 2009
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafer and its manufacturing method
- Patent number 7,544,583
- Issue date Jun 9, 2009
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor substrate
- Patent number 7,494,899
- Issue date Feb 24, 2009
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 7,446,016
- Issue date Nov 4, 2008
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded substrate and bonded substrate manu...
- Patent number 7,442,623
- Issue date Oct 28, 2008
- Sumco Corporation
- Akihiko Endo
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
EPITAXIAL WAFER AND PRODUCTION METHOD THEREOF
- Publication number 20120126361
- Publication date May 24, 2012
- SUMCO CORPORATION
- Yoshiro AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLING FILM THINNING OF SEMICONDUCTOR WAFER FOR SOLI...
- Publication number 20110136267
- Publication date Jun 9, 2011
- SUMCO CORPORATION
- Etsurou MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER AND METHOD OF PRODUCING THE SAME
- Publication number 20110084367
- Publication date Apr 14, 2011
- SUMCO CORPORATION
- Hideki NISHIHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE
- Publication number 20110027969
- Publication date Feb 3, 2011
- SUMCO CORPORATION
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A BONDED WAFER
- Publication number 20100248447
- Publication date Sep 30, 2010
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Bonded Wafer
- Publication number 20100184270
- Publication date Jul 22, 2010
- SUMCO CORPORATION
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BONDED WAFER
- Publication number 20100178750
- Publication date Jul 15, 2010
- SUMCO CORPORATION
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING BONDED WAFER
- Publication number 20100144119
- Publication date Jun 10, 2010
- SUMCO CORPORATION
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BONDED SILICON WAFER
- Publication number 20100068867
- Publication date Mar 18, 2010
- SUMCO CORPORATION
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BONDED WAFER
- Publication number 20100015779
- Publication date Jan 21, 2010
- SUMCO CORPORATION
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER AND PRODUCTION METHOD THEREOF
- Publication number 20090321874
- Publication date Dec 31, 2009
- SUMCO CORPORATION
- Yoshiro AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Producing Bonded Wafer
- Publication number 20090298261
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Producing Bonded Wafer
- Publication number 20090280621
- Publication date Nov 12, 2009
- SUMCO CORPORATION
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonded wafer
- Publication number 20090258475
- Publication date Oct 15, 2009
- SUMCO CORPORATION
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonded wafer
- Publication number 20090186464
- Publication date Jul 23, 2009
- SUMCO CORPORATION
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI SUBSTRATE
- Publication number 20090117708
- Publication date May 7, 2009
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonded wafer
- Publication number 20090098707
- Publication date Apr 16, 2009
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE
- Publication number 20090075453
- Publication date Mar 19, 2009
- SUMCO CORPORATION
- Satoshi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING BONDED WAFER
- Publication number 20090023272
- Publication date Jan 22, 2009
- SUMCO CORPORATION
- Hideki Nishihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING BONDED WAFER
- Publication number 20080248630
- Publication date Oct 9, 2008
- SUMCO CORPORATION
- Akihiko ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing bonded wafer
- Publication number 20080227271
- Publication date Sep 18, 2008
- SUMCO CORPORATION
- Nobuyuki MORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing bonded wafer
- Publication number 20080213974
- Publication date Sep 4, 2008
- SUMCO CORPORATION
- Hidehiko OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Bonded Wafer
- Publication number 20080200010
- Publication date Aug 21, 2008
- SUMCO CORPORATION
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Regenerating Layer Transferred Wafer and Layer Transfer...
- Publication number 20080124929
- Publication date May 29, 2008
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING BONDED WAFER
- Publication number 20080070377
- Publication date Mar 20, 2008
- SUMCO CORPORATION
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-on Insulator Substrate and Method for manufacturing the Same
- Publication number 20080063840
- Publication date Mar 13, 2008
- Etsurou Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded wafer and method of manufacturing the same
- Publication number 20080061452
- Publication date Mar 13, 2008
- SUMCO CORPORATION
- Hideki NISHIHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED WAFER AND METHOD FOR PRODUCING BONDED WAFER
- Publication number 20080057676
- Publication date Mar 6, 2008
- SUMCO CORPORATION
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing SOI Substrate
- Publication number 20080014716
- Publication date Jan 17, 2008
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing SOI Substrate
- Publication number 20080014717
- Publication date Jan 17, 2008
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS

Akihiko Endo

Person

Patents Grantslast 30 patents

Method of manufacturing bonded wafer

Epitaxial wafer and production method thereof

Method for producing semiconductor substrate

Epitaxial wafer and production method thereof

Method of manufacturing semiconductor wafer by forming a strain rel...

Bonded wafer and method for producing bonded wafer

Method for producing bonded wafer

Method for producing a bonded wafer

Method of controlling film thinning of semiconductor wafer for soli...

Method of producing semiconductor substrate having an SOI structure

Method for producing bonded silicon wafer

Method for producing bonded wafer

Method of producing bonded wafer

Method for manufacturing SOI wafer

Laminated substrate manufacturing method and laminated substrate ma...

Method of manufacturing bonded wafer

Method for producing semiconductor substrate

Method of producing semiconductor substrate having an SOI structure

Process for producing SOI substrate and process for regeneration of...

Method of manufacturing bonded wafer

Process for regenerating layer transferred wafer

Silicon-on insulator substrate and method for manufacturing the same

Method for producing bonded wafer

SOI wafer and its manufacturing method

Method for producing bonded wafer

Method for manufacturing bonded wafer

SOI wafer and its manufacturing method

Method for manufacturing semiconductor substrate

Method for producing bonded wafer

Method for manufacturing bonded substrate and bonded substrate manu...

Patents Applicationslast 30 patents

EPITAXIAL WAFER AND PRODUCTION METHOD THEREOF

METHOD OF CONTROLLING FILM THINNING OF SEMICONDUCTOR WAFER FOR SOLI...

EPITAXIAL WAFER AND METHOD OF PRODUCING THE SAME

METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE

METHOD FOR PRODUCING A BONDED WAFER

Method for Producing Bonded Wafer

METHOD FOR PRODUCING BONDED WAFER

METHOD OF PRODUCING BONDED WAFER

METHOD FOR PRODUCING BONDED SILICON WAFER

METHOD FOR PRODUCING BONDED WAFER

EPITAXIAL WAFER AND PRODUCTION METHOD THEREOF

Method For Producing Bonded Wafer

Method Of Producing Bonded Wafer

Method for producing bonded wafer

Method for producing bonded wafer

METHOD FOR MANUFACTURING SOI SUBSTRATE

Method for producing bonded wafer

METHOD OF PRODUCING SEMICONDUCTOR SUBSTRATE

METHOD OF PRODUCING BONDED WAFER

METHOD OF MANUFACTURING BONDED WAFER

Method of manufacturing bonded wafer

Method of manufacturing bonded wafer

Method for Manufacturing Bonded Wafer

Process for Regenerating Layer Transferred Wafer and Layer Transfer...

METHOD OF PRODUCING BONDED WAFER

Silicon-on Insulator Substrate and Method for manufacturing the Same

Bonded wafer and method of manufacturing the same

BONDED WAFER AND METHOD FOR PRODUCING BONDED WAFER

Method for Manufacturing SOI Substrate

Method for Manufacturing SOI Substrate