Akihiko Hatasawa

Person

Akita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Through-holes of a semiconductor chip
- Patent number 10,734,322
- Issue date Aug 4, 2020
- LONGITUDE LICENSING LIMITED
- Akihiko Hatasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-holes of a semiconductor chip
- Patent number 10,475,746
- Issue date Nov 12, 2019
- LONGITUDE LICENSING LIMITED
- Akihiko Hatasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder layer of a semiconductor chip arranged within recesses
- Patent number 10,115,693
- Issue date Oct 30, 2018
- LONGITUDE LICENSING LIMITED
- Akihiko Hatasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,928,551
- Issue date Apr 19, 2011
- Elpida Memory, Inc.
- Reiko Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor chip formed on an in...
- Patent number 7,372,130
- Issue date May 13, 2008
- Elpida Memory, Inc.
- Koya Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and its manufacturing method
- Patent number 7,321,165
- Issue date Jan 22, 2008
- Elpida Memory, Inc.
- Yutaka Kagaya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLES OF A SEMICONDUCTOR CHIP
- Publication number 20200075494
- Publication date Mar 5, 2020
- Longitude Licensing Limited
- Akihiko Hatasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLES OF A SEMICONDUCTOR CHIP
- Publication number 20190051602
- Publication date Feb 14, 2019
- Longitude Licensing Limited
- Akihiko Hatasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE PROVIDED WITH SEMICONDU...
- Publication number 20160027755
- Publication date Jan 28, 2016
- PS4 LUXCO S.A.R.L.
- Akihiko Hatasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090096111
- Publication date Apr 16, 2009
- Elpida Memory, Inc.
- Reiko Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20080199979
- Publication date Aug 21, 2008
- Koya Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060163745
- Publication date Jul 27, 2006
- Shiro Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050258519
- Publication date Nov 24, 2005
- Koya Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20050077608
- Publication date Apr 14, 2005
- Yutaka Kagaya
- H01 - BASIC ELECTRIC ELEMENTS

Akihiko Hatasawa

Person

Patents Grantslast 30 patents

Through-holes of a semiconductor chip

Through-holes of a semiconductor chip

Solder layer of a semiconductor chip arranged within recesses

Semiconductor device and method of manufacturing the same

Semiconductor device including a semiconductor chip formed on an in...

Semiconductor device and its manufacturing method

Patents Applicationslast 30 patents

THROUGH-HOLES OF A SEMICONDUCTOR CHIP

THROUGH-HOLES OF A SEMICONDUCTOR CHIP

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE PROVIDED WITH SEMICONDU...

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device and its manufacturing method