Akihiko Kamada

Person

Yasu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Module board and manufacturing method thereof
- Patent number 9,674,970
- Issue date Jun 6, 2017
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method of manufacturing the same
- Patent number 9,456,503
- Issue date Sep 27, 2016
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module
- Patent number 9,414,513
- Issue date Aug 9, 2016
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile semiconductor module with metal film support
- Patent number 9,293,446
- Issue date Mar 22, 2016
- Murata Manufacturing Co., Ltd.
- Mitsuhiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method of manufacturing the same
- Patent number 9,137,904
- Issue date Sep 15, 2015
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
ESD Protection Device
- Patent number 8,437,114
- Issue date May 7, 2013
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnection board
- Patent number 8,207,452
- Issue date Jun 26, 2012
- Murata Manufacturing Co., Ltd.
- Issey Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming circuit pattern
- Patent number 7,736,830
- Issue date Jun 15, 2010
- Murata Manufacturing Co., Ltd.
- Akihiko Kamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit-forming charging powder and multilayer wiring board using t...
- Patent number 6,403,272
- Issue date Jun 11, 2002
- Murata Manufacturing Co. Ltd.
- Akihiko Kamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit-forming charging powder and multilayer wiring board using t...
- Patent number 6,214,508
- Issue date Apr 10, 2001
- Murata Manufacturing Co., Ltd.
- Akihiko Kamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing ceramic electronic parts
- Patent number 6,165,659
- Issue date Dec 26, 2000
- Murata Manufacturing Co., Ltd.
- Akihiko Kamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrophotographic apparatus
- Patent number 6,157,789
- Issue date Dec 5, 2000
- Murata Manufacturing Co., Ltd.
- Akihiko Kamada
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Production method for ceramic green sheet
- Patent number 6,036,912
- Issue date Mar 14, 2000
- Murata Manufacturing Co., Ltd.
- Akihiko Kamada
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of manufacturing ceramic multilayer circuit component and ha...
- Patent number 5,573,620
- Issue date Nov 12, 1996
- Murata Manufacturing Co., Ltd.
- Norio Sakai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Handling apparatus for ceramic green sheet
- Patent number 5,466,330
- Issue date Nov 14, 1995
- Murata Manufacturing Co., Ltd.
- Norio Sakai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MODULE
- Publication number 20150179621
- Publication date Jun 25, 2015
- MURATA MANUFACTURING CO., LTD.
- Mitsuhiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20150103495
- Publication date Apr 16, 2015
- MURATA MANUFACTURING CO., LTD.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140268587
- Publication date Sep 18, 2014
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140262442
- Publication date Sep 18, 2014
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20130077262
- Publication date Mar 28, 2013
- Murata Manufacturing Co., Ltd.
- Issei YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ESD PROTECTION DEVICE
- Publication number 20110216456
- Publication date Sep 8, 2011
- Murata Manufacturing Co., Ltd.
- Issei YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER INTERCONNECTION BOARD
- Publication number 20090218123
- Publication date Sep 3, 2009
- Murata Manufacturing Co., Ltd.
- Issey Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CIRCUIT PATTERN
- Publication number 20080305425
- Publication date Dec 11, 2008
- Akihiko Kamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit-forming charging powder and multilayer wiring board using t...
- Publication number 20010006756
- Publication date Jul 5, 2001
- Murata Manufacturing Co., Ltd.
- Akihiko Kamada
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Akihiko Kamada

Person

Patents Grantslast 30 patents

Module board and manufacturing method thereof

Module and method of manufacturing the same

Electronic component module

Low profile semiconductor module with metal film support

Module and method of manufacturing the same

ESD Protection Device

Multilayer interconnection board

Method for forming circuit pattern

Circuit-forming charging powder and multilayer wiring board using t...

Circuit-forming charging powder and multilayer wiring board using t...

Method of manufacturing ceramic electronic parts

Electrophotographic apparatus

Production method for ceramic green sheet

Method of manufacturing ceramic multilayer circuit component and ha...

Handling apparatus for ceramic green sheet

Patents Applicationslast 30 patents

MODULE

ELECTRONIC COMPONENT MODULE

MODULE AND METHOD OF MANUFACTURING THE SAME

MODULE AND METHOD OF MANUFACTURING THE SAME

MODULE BOARD AND MANUFACTURING METHOD THEREOF

ESD PROTECTION DEVICE

MULTILAYER INTERCONNECTION BOARD

METHOD FOR FORMING CIRCUIT PATTERN

Circuit-forming charging powder and multilayer wiring board using t...