Akihiko Ohsaki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 7,906,848
- Issue date Mar 15, 2011
- Renesas Electronics Corporation
- Yukihiro Kumagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing structure for connecting interconnect lines...
- Patent number 6,780,769
- Issue date Aug 24, 2004
- Renesas Technology Corp.
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure for an integrated circuit
- Patent number 6,664,641
- Issue date Dec 16, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Akihiko Ohsaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for connecting interconnect lines with interposed layer i...
- Patent number 6,624,516
- Issue date Sep 23, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a layer of thermally stable titanium...
- Patent number 6,198,143
- Issue date Mar 6, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Akihiko Ohsaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing interconnection structure of a semiconducto...
- Patent number 5,712,140
- Issue date Jan 27, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Atsushi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming multi-layer interconnection
- Patent number 5,677,243
- Issue date Oct 14, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Akihiko Ohsaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising composite barrier layer
- Patent number 5,565,708
- Issue date Oct 15, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Akihiko Ohsaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer interconnection structure for a semiconductor device
- Patent number 5,475,267
- Issue date Dec 12, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Atsushi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnection structure for a semiconductor device
- Patent number 5,313,100
- Issue date May 17, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Atsushi Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical type MOS transistor and method of formation thereof
- Patent number 5,017,504
- Issue date May 21, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tadashi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 4,959,329
- Issue date Sep 25, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Tatsuo Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having improved connecting structure of...
- Patent number 4,953,125
- Issue date Aug 28, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Yoshinori Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 4,887,143
- Issue date Dec 12, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Tatsuo Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical type MOS transistor and method of formation thereof
- Patent number 4,845,537
- Issue date Jul 4, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Tadashi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090212437
- Publication date Aug 27, 2009
- Yukihiro Kumagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for connecting interconnect lines and method of manufactu...
- Publication number 20030205825
- Publication date Nov 6, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure for an integrated circuit
- Publication number 20030189224
- Publication date Oct 9, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Akihiko Ohsaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR CONNECTING INTERCONNECT LINES WITH INTERPOSED LAYER I...
- Publication number 20020171149
- Publication date Nov 21, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Masahiko Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS

Akihiko Ohsaki

Person

Patents Grantslast 30 patents

Semiconductor device

Method of manufacturing structure for connecting interconnect lines...

Wiring structure for an integrated circuit

Structure for connecting interconnect lines with interposed layer i...

Semiconductor device including a layer of thermally stable titanium...

Method of manufacturing interconnection structure of a semiconducto...

Method of forming multi-layer interconnection

Semiconductor device comprising composite barrier layer

Multilayer interconnection structure for a semiconductor device

Multilayer interconnection structure for a semiconductor device

Vertical type MOS transistor and method of formation thereof

Semiconductor device

Semiconductor memory device having improved connecting structure of...

Semiconductor device

Vertical type MOS transistor and method of formation thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Structure for connecting interconnect lines and method of manufactu...

Wiring structure for an integrated circuit

STRUCTURE FOR CONNECTING INTERCONNECT LINES WITH INTERPOSED LAYER I...