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Akihiko Tateiwa
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Nagano-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Electrostatic adsorption member and substrate fixing device
Patent number
11,881,794
Issue date
Jan 23, 2024
Shinko Electric Industries Co., Ltd.
Hiroyuki Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic apparatus having a resin filled through electrode config...
Patent number
9,515,050
Issue date
Dec 6, 2016
Shinko Electric Industries Co., Ltd.
Kenta Uchiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate having multiple core substrates
Patent number
9,386,695
Issue date
Jul 5, 2016
Shinko Electric Industries Co., Ltd.
Jun Furuichi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package and manufacturing method therefor
Patent number
9,299,678
Issue date
Mar 29, 2016
Shinko Electric Industries Co., Ltd.
Masahiro Kyozuka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
Patent number
9,142,524
Issue date
Sep 22, 2015
Shinko Electric Industries Co., Ltd.
Masahiro Kyozuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate and method of manufacturing the same
Patent number
9,078,384
Issue date
Jul 7, 2015
Shinko Electric Industries Co., Ltd.
Jun Furuichi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package, semiconductor device, and method for manufac...
Patent number
9,054,082
Issue date
Jun 9, 2015
Shinko Electric Industries Co., Ltd.
Noriyoshi Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a metal plate, semiconductor chip,...
Patent number
8,994,193
Issue date
Mar 31, 2015
Shinko Electric Industries Co., Ltd.
Akihiko Tateiwa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package and manufacturing method
Patent number
8,941,230
Issue date
Jan 27, 2015
Shinko Electric Industries Co., Ltd.
Masahiro Kyozuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board and method of manufacturing the same, and semiconducto...
Patent number
8,901,725
Issue date
Dec 2, 2014
Shinko Electric Industries Co., Ltd.
Akihiko Tateiwa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stacked chips package having feed-through electrode connecting the...
Patent number
8,786,103
Issue date
Jul 22, 2014
Shinko Electric Industries Co., Ltd.
Kenta Uchiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate, semiconductor device and manufacturing method the...
Patent number
8,659,127
Issue date
Feb 25, 2014
Shinko Electric Industries Co., Ltd.
Naoyuki Koizumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fine wiring package and method of manufacturing the same
Patent number
8,530,753
Issue date
Sep 10, 2013
Shinko Electric Industries Co., Ltd.
Yuji Kunimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package with its surface edge covered by resin
Patent number
8,436,471
Issue date
May 7, 2013
Shinko Electric Industries Co., Ltd.
Teruaki Chino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin-sealed package and method of producing the same
Patent number
8,399,977
Issue date
Mar 19, 2013
Shinko Electric Industries Co., Ltd.
Yuji Kunimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board with lead pins and method of producing the same
Patent number
8,314,347
Issue date
Nov 20, 2012
Shinko Electric Industries Co., Ltd.
Kenta Uchiyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device, manufacturing method thereof, and electronic...
Patent number
8,169,072
Issue date
May 1, 2012
Shinko Electric Industries Co., Ltd.
Kenta Uchiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package
Patent number
8,153,479
Issue date
Apr 10, 2012
Shinko Electric Industries Co., Ltd.
Tohru Hizume
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same, and sem...
Patent number
8,120,166
Issue date
Feb 21, 2012
Shinko Electric Industries Co., Ltd.
Naoyuki Koizumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Module substrate including optical transmission mechanism and metho...
Patent number
8,111,954
Issue date
Feb 7, 2012
Shinko Electric Industries Co., Ltd.
Naoyuki Koizumi
G02 - OPTICS
Information
Patent Grant
Manufacturing method of semiconductor package
Patent number
8,017,503
Issue date
Sep 13, 2011
Shinko Electric Industries Co., Ltd.
Kiyoshi Oi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package for semiconductor device and method of manufacturing the same
Patent number
7,963,031
Issue date
Jun 21, 2011
Shinko Electric Industries Co., Ltd.
Naoyuki Koizumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing semiconductor element mounted wiring board
Patent number
7,939,377
Issue date
May 10, 2011
Shinko Electric Industries Co., Ltd.
Fumimasa Katagiri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tape fiber and method for treating same
Patent number
7,133,589
Issue date
Nov 7, 2006
Shinko Electric Industries Co., Ltd.
Akihiko Tateiwa
G02 - OPTICS
Information
Patent Grant
Optical collimator structure
Patent number
7,016,574
Issue date
Mar 21, 2006
Shinko Electric Industries Co., Ltd.
Akihiko Tateiwa
G02 - OPTICS
Patents Applications
last 30 patents
Information
Patent Application
ELECTROSTATIC ADSORPTION MEMBER AND SUBSTRATE FIXING DEVICE
Publication number
20220345054
Publication date
Oct 27, 2022
Shinko Electric Industries Co., Ltd.
Hiroyuki Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC APPARATUS AND FABRICATION METHOD OF THE SAME
Publication number
20140291865
Publication date
Oct 2, 2014
Shinko Electric Industries Co., Ltd.
Kenta UCHIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD
Publication number
20140070396
Publication date
Mar 13, 2014
Shinko Electric Industries Co., Ltd.
Masahiro Kyozuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
Publication number
20130328211
Publication date
Dec 12, 2013
Noriyoshi SHIMIZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
Publication number
20130264101
Publication date
Oct 10, 2013
Shinko Electric Industries Co., Ltd.
Jun FURUICHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUF...
Publication number
20130249075
Publication date
Sep 26, 2013
Shinko Electric Industries Co., Ltd.
Akihiko Tateiwa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THE...
Publication number
20120313226
Publication date
Dec 13, 2012
Shinko Electric Industries Co., Ltd.
Naoyuki Koizumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
Publication number
20120234589
Publication date
Sep 20, 2012
SHINKO ELECTRIC INDUSTRIES., LTD.
Jun FURUICHI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
Publication number
20120187557
Publication date
Jul 26, 2012
Shinko Electric Industries Co., Ltd.
Masahiro KYOZUKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
Publication number
20120153509
Publication date
Jun 21, 2012
Shinko Electric Industries Co., Ltd.
Masahiro Kyozuka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTO...
Publication number
20110227214
Publication date
Sep 22, 2011
Shinko Electric Industries Co., Ltd.
Akihiko Tateiwa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Publication number
20110104886
Publication date
May 5, 2011
Shinko Electric Industries Co., Ltd.
Kiyoshi OI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT MOUNTED WIRING BOARD
Publication number
20110104858
Publication date
May 5, 2011
Shinko Electric Industries Co., Ltd.
Fumimasa KATAGIRI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20110062578
Publication date
Mar 17, 2011
Shinko Electric Industries Co., Ltd.
Fumimasa Katagiri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
Publication number
20110049726
Publication date
Mar 3, 2011
Shinko Electric Industries Co., Ltd.
Teruaki CHINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Publication number
20110045642
Publication date
Feb 24, 2011
Shinko Electric Industries Co., Ltd.
Tohru HIZUME
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC APPARATUS AND FABRICATION METHOD OF THE SAME
Publication number
20100258944
Publication date
Oct 14, 2010
Shinko Electric Industries Co., Ltd.
Kenta Uchiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
Publication number
20100258946
Publication date
Oct 14, 2010
Shinko Electric Industries Co., Ltd.
Kenta Uchiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN-SEALED PACKAGE AND METHOD OF PRODUCING THE SAME
Publication number
20100155925
Publication date
Jun 24, 2010
Shinko Electric Industries Co., Ltd.
Yuji KUNIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FINE WIRING PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20100155126
Publication date
Jun 24, 2010
Shinko Electric Industries Co., Ltd.
Yuji KUNIMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD WITH LEAD PINS AND METHOD OF PRODUCING THE SAME
Publication number
20100147561
Publication date
Jun 17, 2010
Shinko Electric Industries Co., Ltd.
Kenta Uchiyama
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME, AND SEM...
Publication number
20100052153
Publication date
Mar 4, 2010
Shinko Electric Industries Co., Ltd.
Naoyuki Koizumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MODULE SUBSTRATE INCLUDING OPTICAL TRANMISSION MECHANISM AND METHOD...
Publication number
20090245724
Publication date
Oct 1, 2009
Shinko Electric Industries Co., Ltd.
Naoyuki KOIZUMI
G02 - OPTICS
Information
Patent Application
PACKAGE FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20090151995
Publication date
Jun 18, 2009
Shinko Electric Industries Co., Ltd.
Naoyuki Koizumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISPLAY DEVICE
Publication number
20090073525
Publication date
Mar 19, 2009
Shinko Electric Industries Co., Ltd.
Akihiko Tateiwa
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
Optical fiber collimator and manufacturing method thereof
Publication number
20050089272
Publication date
Apr 28, 2005
Akihiko Tateiwa
G02 - OPTICS
Information
Patent Application
Optical collimator structure
Publication number
20040208440
Publication date
Oct 21, 2004
Shinko Electric Industries Co., Ltd.
Akihiko Tateiwa
G02 - OPTICS
Information
Patent Application
Tape fiber and method for treating same
Publication number
20040091226
Publication date
May 13, 2004
Shinko Electric Industries Co., Ltd.
Akihiko Tateiwa
G02 - OPTICS