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Method for feeding a component
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Patent number 6,877,220
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Issue date Apr 12, 2005
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Matsushita Electric Industrial Co., Ltd.
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Takeshi Kuribayashi
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Method for controlling screen printer
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Patent number 6,748,289
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Issue date Jun 8, 2004
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Matsushita Electric Industrial Co., Ltd.
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Noboru Nishikawa
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H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Reflow soldering apparatus and method
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Patent number 6,561,407
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Issue date May 13, 2003
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Matsushita Electric Industrial Co., Ltd.
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Nobuyasu Nagafuku
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Adhesive applying apparatus
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Patent number 6,394,161
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Issue date May 28, 2002
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Matsushita Electric Industrial Co., Ltd.
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Nobuyuki Kakishima
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B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
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Reflow soldering apparatus and method
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Patent number 6,382,497
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Issue date May 7, 2002
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Matsushita Electric Industrial Co., Ltd.
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Nobuyasu Nagafuku
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Adhesive applying apparatus
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Patent number 6,050,314
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Issue date Apr 18, 2000
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Matsushita Electric Industrial Co., Ltd.
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Nobuyuki Kakishima
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B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
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Adhesive applying method
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Patent number 5,867,390
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Issue date Feb 2, 1999
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Matsushita Electric Industrial Co., Ltd.
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Toshiyuki Kinoh
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B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...