Akihiro Aiba

Person

Kitaibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electrolytic copper plating method, phosphorous copper anode for el...
- Patent number 8,252,157
- Issue date Aug 28, 2012
- JX Nippon Mining & Metals Corporation
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper anode or phosphorous-containing copper anode, method of elec...
- Patent number 8,216,438
- Issue date Jul 10, 2012
- JX Nippon Mining & Metals Corporation
- Akihiro Aiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrolytic copper plating method, pure copper anode for electroly...
- Patent number 7,943,033
- Issue date May 17, 2011
- JX Nippon Mining & Metals Corporation
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper plating method, pure copper anode for electroly...
- Patent number 7,799,188
- Issue date Sep 21, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroless palladium plating liquid
- Patent number 7,704,307
- Issue date Apr 27, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper electroplating method, pure copper anode for copper electrop...
- Patent number 7,648,621
- Issue date Jan 19, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroless gold plating liquid
- Patent number 7,419,536
- Issue date Sep 2, 2008
- Nikko Materials Co., Ltd.
- Akihiro Aiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless gold plating solution
- Patent number 7,396,394
- Issue date Jul 8, 2008
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treating agent for metal
- Patent number 7,393,395
- Issue date Jul 1, 2008
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless gold plating solution
- Patent number 7,390,354
- Issue date Jun 24, 2008
- Nikko Materials Co., Ltd.
- Akihiro Aiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolytic copper plating method, phosphorus-containing anode for...
- Patent number 7,374,651
- Issue date May 20, 2008
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic copper plating method, phosphorous copper anode for el...
- Patent number 7,138,040
- Issue date Nov 21, 2006
- Nippon Mining & Metals Co., Ltd.
- Takeo Okabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROW...
- Publication number 20140158546
- Publication date Jun 12, 2014
- JX Nippon Mining & Metals Corporation
- Junnosuke SEKIGUCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROW...
- Publication number 20120103820
- Publication date May 3, 2012
- Junnosuke Sekiguchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...
- Publication number 20100307923
- Publication date Dec 9, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Anode or Phosphorous-Containing Copper Anode, Method of Elec...
- Publication number 20100096271
- Publication date Apr 22, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...
- Publication number 20100000871
- Publication date Jan 7, 2010
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless Palladium Plating Liquid
- Publication number 20090081369
- Publication date Mar 26, 2009
- Akihiro Aiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrolytic Copper Plating Method, Phosphorous Copper Anode for El...
- Publication number 20080210568
- Publication date Sep 4, 2008
- Nippon Mining & Metals Co., Ltd.
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless Gold Plating Solution
- Publication number 20070209548
- Publication date Sep 13, 2007
- Akihiro Aiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface-treating agent for metal
- Publication number 20070157845
- Publication date Jul 12, 2007
- Akihiro Aiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless gold plating liquid
- Publication number 20060269761
- Publication date Nov 30, 2006
- Akihiro Aiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless gold plating solution
- Publication number 20060230979
- Publication date Oct 19, 2006
- Akihiro Aiba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper electroplating method, pure copper anode for copper electrop...
- Publication number 20040200727
- Publication date Oct 14, 2004
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic cooper plating method, phosphorus-containing anode for...
- Publication number 20040149588
- Publication date Aug 5, 2004
- Akihiro Aiba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolytic copper plating method, phosphorous copper anode for el...
- Publication number 20040007474
- Publication date Jan 15, 2004
- Takeo Okabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Akihiro Aiba

Person

Patents Grantslast 30 patents

Electrolytic copper plating method, phosphorous copper anode for el...

Copper anode or phosphorous-containing copper anode, method of elec...

Electrolytic copper plating method, pure copper anode for electroly...

Electrolytic copper plating method, pure copper anode for electroly...

Electroless palladium plating liquid

Copper electroplating method, pure copper anode for copper electrop...

Electroless gold plating liquid

Electroless gold plating solution

Surface-treating agent for metal

Electroless gold plating solution

Electrolytic copper plating method, phosphorus-containing anode for...

Electrolytic copper plating method, phosphorous copper anode for el...

Patents Applicationslast 30 patents

ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROW...

ELECTROLYTIC COPPER PLATING SOLUTION FOR FILLING FOR FORMING MICROW...

Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...

Copper Anode or Phosphorous-Containing Copper Anode, Method of Elec...

Electrolytic Copper Plating Method, Pure Copper Anode for Electroly...

Electroless Palladium Plating Liquid

Electrolytic Copper Plating Method, Phosphorous Copper Anode for El...

Electroless Gold Plating Solution

Surface-treating agent for metal

Electroless gold plating liquid

Electroless gold plating solution

Copper electroplating method, pure copper anode for copper electrop...

Electrolytic cooper plating method, phosphorus-containing anode for...

Electrolytic copper plating method, phosphorous copper anode for el...