Akihiro Demura

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Ogaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate for mounting electronic part
- Patent number 6,229,101
- Issue date May 8, 2001
- Ibiden Co. Ltd.
- Masataka Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for mounting electronic part
- Patent number 6,011,222
- Issue date Jan 4, 2000
- Ibiden Co., Ltd.
- Masataka Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating type molded coil
- Patent number 5,652,561
- Issue date Jul 29, 1997
- Yokogawa Electric Corporation
- Kiyoharu Inoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and process for producing thereof
- Patent number 5,616,256
- Issue date Apr 1, 1997
- Ibiden Co., Inc.
- Akihiro Demura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having indications thereon covered by insulation
- Patent number 5,512,712
- Issue date Apr 30, 1996
- Ibiden Co., Ltd.
- Yutaka Iwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having a blind via
- Patent number 5,493,077
- Issue date Feb 20, 1996
- Ibiden Co., Ltd.
- Akihiro Demura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR