Akihiro Fukui

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dicing-tape integrated film for backside of semiconductor and metho...
- Patent number 10,141,217
- Issue date Nov 27, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material, laminated sheet and method for producing semico...
- Patent number 10,014,235
- Issue date Jul 3, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing-tape integrated film for backside of semiconductor and metho...
- Patent number 9,679,797
- Issue date Jun 13, 2017
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Underfill Material, Laminated Sheet and Method for Producing Semico...
- Publication number 20170018472
- Publication date Jan 19, 2017
- NITTO DENKO CORPORATION
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin C...
- Publication number 20160240523
- Publication date Aug 18, 2016
- NITTO DENKO CORPORATION
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Manufacturing Method
- Publication number 20160240394
- Publication date Aug 18, 2016
- NITTO DENKO CORPORATION
- Akihiro Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Manufacturing Method
- Publication number 20160233184
- Publication date Aug 11, 2016
- Nitto Denko Corporation
- Hiroyuki Hanazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING A SEMICOND...
- Publication number 20160075871
- Publication date Mar 17, 2016
- NITTO DENKO CORPORATION
- Kosuke MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR UNDERFILL, ADHESIVE FILM FOR UNDERFILL INTEGRATED...
- Publication number 20160040045
- Publication date Feb 11, 2016
- Nitto Denko Corporation
- Kosuke MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
UNDERFILL FILM, SEALING SHEET, METHOD OF MANUFACTURING SEMICONDUCTO...
- Publication number 20160035640
- Publication date Feb 4, 2016
- Nitto Denko Corporation
- Kosuke MORITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD, SHEET-SHAPED RESIN COMPOSIT...
- Publication number 20160013089
- Publication date Jan 14, 2016
- NITTO DENKO CORPORATION
- Naohide Takamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
UNDERFILL SHEET, UNDERFILL SHEET INTEGRATED WITH TAPE FOR GRINDING...
- Publication number 20150380277
- Publication date Dec 31, 2015
- NITTO DENKO CORPORATION
- Kosuke Morita
- B32 - LAYERED PRODUCTS
Information Patent Application
DICING-TAPE INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR AND METHO...
- Publication number 20150364357
- Publication date Dec 17, 2015
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING-TAPE INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR AND METHO...
- Publication number 20150357223
- Publication date Dec 10, 2015
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Akihiro Fukui

Person

Patents Grantslast 30 patents

Dicing-tape integrated film for backside of semiconductor and metho...

Underfill material, laminated sheet and method for producing semico...

Dicing-tape integrated film for backside of semiconductor and metho...

Patents Applicationslast 30 patents

Underfill Material, Laminated Sheet and Method for Producing Semico...

Method for Manufacturing Semiconductor Device, Sheet-Shaped Resin C...

Semiconductor Device Manufacturing Method

Semiconductor Device Manufacturing Method

THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING A SEMICOND...

ADHESIVE FILM FOR UNDERFILL, ADHESIVE FILM FOR UNDERFILL INTEGRATED...

UNDERFILL FILM, SEALING SHEET, METHOD OF MANUFACTURING SEMICONDUCTO...

SEMICONDUCTOR DEVICE PRODUCTION METHOD, SHEET-SHAPED RESIN COMPOSIT...

UNDERFILL SHEET, UNDERFILL SHEET INTEGRATED WITH TAPE FOR GRINDING...

DICING-TAPE INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR AND METHO...

DICING-TAPE INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR AND METHO...