Akihiro Hidaka

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Yoshiki-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming connector structure for a ball-grid array
- Patent number 6,199,273
- Issue date Mar 13, 2001
- Sumitomo Metal Industries, Ltd.
- Toshihiko Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid with variable solder layer for sealing semiconductor package, p...
- Patent number 5,821,455
- Issue date Oct 13, 1998
- Sumitomo Metal (SMI) Electronics Devices, Inc.
- Tetsuya Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS