Akihiro Horibe

Person

Kanagawa-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection between chips by bridge chip
- Patent number 12,094,825
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling of height of high-density interconnection structure on...
- Patent number 12,087,596
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon handler with laser-release layers
- Patent number 11,908,723
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection between chips by bridge chip
- Patent number 11,848,272
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large capacity solid state battery
- Patent number 11,637,325
- Issue date Apr 25, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill injection for electronic devices
- Patent number 11,574,848
- Issue date Feb 7, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sampling of breath gas
- Patent number 11,320,419
- Issue date May 3, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device structure
- Patent number 11,316,143
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large capacity solid state battery
- Patent number 11,211,638
- Issue date Dec 28, 2021
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling of height of high-density interconnection structure on...
- Patent number 11,114,308
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked film battery architecture
- Patent number 11,069,917
- Issue date Jul 20, 2021
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked film battery architecture
- Patent number 11,063,288
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron device stack structure
- Patent number 10,903,526
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Kuniaki Sueoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale testing and initialization of small die chips
- Patent number 10,679,912
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and manufacturing method thereof
- Patent number 10,679,916
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Picking up irregular semiconductor chips
- Patent number 10,672,638
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnecting adhesive tape
- Patent number 10,622,311
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of stress in via structure
- Patent number 10,593,616
- Issue date Mar 17, 2020
- Tessera, Inc.
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnecting adhesive tape
- Patent number 10,529,665
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package assembly
- Patent number 10,460,971
- Issue date Oct 29, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked film battery architecture
- Patent number 10,431,847
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fill into high aspect through holes
- Patent number 10,424,510
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder fill into high aspect through holes
- Patent number 10,388,566
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer scale testing and initialization of small die chips
- Patent number 10,388,578
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of stress in via structure
- Patent number 10,325,839
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer waveguide (PWG) connector assembly having both cores and cl...
- Patent number 10,317,625
- Issue date Jun 11, 2019
- International Business Machines Corporation
- Akihiro Horibe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polymer waveguide connector assembly method using cores and claddin...
- Patent number 10,302,868
- Issue date May 28, 2019
- International Business Machines Corporation
- Akihiro Horibe
- G02 - OPTICS
Information Patent Grant
Forming a solder joint between metal layers
- Patent number 10,252,363
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RELEASE LAYER CONTAINING SEMICONDUCTOR-ON-INSULATOR SUBSTRATES
- Publication number 20250048730
- Publication date Feb 6, 2025
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS
- Publication number 20250006681
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP
- Publication number 20230343713
- Publication date Oct 26, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTERCONNECT PACKAGE
- Publication number 20230307307
- Publication date Sep 28, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTERCONNECT PACKAGE FINE JET UNDERFILL
- Publication number 20230307372
- Publication date Sep 28, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL TRANSMON STRUCTURE AND ITS FABRICATION PROCESS
- Publication number 20230180630
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Masao Tokunari
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SILICON HANDLER WITH LASER-RELEASE LAYERS
- Publication number 20230178404
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL VACUUM PROCESS
- Publication number 20230178445
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE CAPACITY SOLID STATE BATTERY
- Publication number 20230170532
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WAFER WITH MULTIPLE ANTIREFLECTIVE COATING LAYERS
- Publication number 20230087366
- Publication date Mar 23, 2023
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP
- Publication number 20230051337
- Publication date Feb 16, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL INJECTION FOR ELECTRONIC DEVICES
- Publication number 20220238403
- Publication date Jul 28, 2022
- International Business Machines Corporation
- AKIHIRO HORIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...
- Publication number 20210343545
- Publication date Nov 4, 2021
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE THIN FILM BATTERY FOR MICROCOMPUTING DEVICES
- Publication number 20210320335
- Publication date Oct 14, 2021
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAMPLING OF BREATH GAS
- Publication number 20210239679
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Akihiro Horibe
- G01 - MEASURING TESTING
Information Patent Application
STACKED DEVICE STRUCTURE
- Publication number 20200358087
- Publication date Nov 12, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON DEVICE STACK STRUCTURE
- Publication number 20200176821
- Publication date Jun 4, 2020
- International Business Machines Corporation
- Kuniaki Sueoka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...
- Publication number 20200098592
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FILM BATTERY ARCHITECTURE
- Publication number 20190305355
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FILM BATTERY ARCHITECTURE
- Publication number 20190296387
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF STRESS IN VIA STRUCTURE
- Publication number 20190214339
- Publication date Jul 11, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS
- Publication number 20190139840
- Publication date May 9, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS
- Publication number 20190103327
- Publication date Apr 4, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS
- Publication number 20190103328
- Publication date Apr 4, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-MODE POLYMER WAVEGUIDE CONNECTOR ASSEMBLY
- Publication number 20190072721
- Publication date Mar 7, 2019
- International Business Machines Corporation
- Akihiro Horibe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SINGLE-MODE POLYMER WAVEGUIDE CONNECTOR ASSEMBLY
- Publication number 20190072722
- Publication date Mar 7, 2019
- International Business Machines Corporation
- Akihiro Horibe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE
- Publication number 20190051603
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE CAPACITY SOLID STATE BATTERY
- Publication number 20190051943
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS

Akihiro Horibe

Person

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Interconnection between chips by bridge chip

Controlling of height of high-density interconnection structure on...

Silicon handler with laser-release layers

Interconnection between chips by bridge chip

Bonding of bridge to multiple semiconductor chips

Large capacity solid state battery

Underfill injection for electronic devices

Sampling of breath gas

Stacked device structure

Large capacity solid state battery

Controlling of height of high-density interconnection structure on...

Stacked film battery architecture

Stacked film battery architecture

Electron device stack structure

Wafer scale testing and initialization of small die chips

Circuit module and manufacturing method thereof

Picking up irregular semiconductor chips

High-density interconnecting adhesive tape

Reduction of stress in via structure

High-density interconnecting adhesive tape

Multi-chip package assembly

Stacked film battery architecture

Solder fill into high aspect through holes

Solder fill into high aspect through holes

Wafer scale testing and initialization of small die chips

Reduction of stress in via structure

Polymer waveguide (PWG) connector assembly having both cores and cl...

Polymer waveguide connector assembly method using cores and claddin...

Forming a solder joint between metal layers

Patents Applicationslast 30 patents

RELEASE LAYER CONTAINING SEMICONDUCTOR-ON-INSULATOR SUBSTRATES

UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS

INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP

MULTICHIP INTERCONNECT PACKAGE

MULTICHIP INTERCONNECT PACKAGE FINE JET UNDERFILL

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

VERTICAL TRANSMON STRUCTURE AND ITS FABRICATION PROCESS

SILICON HANDLER WITH LASER-RELEASE LAYERS

UNDERFILL VACUUM PROCESS

LARGE CAPACITY SOLID STATE BATTERY

CARRIER WAFER WITH MULTIPLE ANTIREFLECTIVE COATING LAYERS

INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

UNDERFILL INJECTION FOR ELECTRONIC DEVICES

CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...

SOLID-STATE THIN FILM BATTERY FOR MICROCOMPUTING DEVICES

SAMPLING OF BREATH GAS

STACKED DEVICE STRUCTURE

ELECTRON DEVICE STACK STRUCTURE

CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...

STACKED FILM BATTERY ARCHITECTURE

STACKED FILM BATTERY ARCHITECTURE

REDUCTION OF STRESS IN VIA STRUCTURE

WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS

WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS

WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS

SINGLE-MODE POLYMER WAVEGUIDE CONNECTOR ASSEMBLY

SINGLE-MODE POLYMER WAVEGUIDE CONNECTOR ASSEMBLY

HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE

LARGE CAPACITY SOLID STATE BATTERY