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Akihiro Horibe

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  • Kanagawa-ken, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP
    • Publication number 20230343713
    • Publication date Oct 26, 2023
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTICHIP INTERCONNECT PACKAGE
    • Publication number 20230307307
    • Publication date Sep 28, 2023
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTICHIP INTERCONNECT PACKAGE FINE JET UNDERFILL
    • Publication number 20230307372
    • Publication date Sep 28, 2023
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
    • Publication number 20230299067
    • Publication date Sep 21, 2023
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VERTICAL TRANSMON STRUCTURE AND ITS FABRICATION PROCESS
    • Publication number 20230180630
    • Publication date Jun 8, 2023
    • International Business Machines Corporation
    • Masao Tokunari
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SILICON HANDLER WITH LASER-RELEASE LAYERS
    • Publication number 20230178404
    • Publication date Jun 8, 2023
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNDERFILL VACUUM PROCESS
    • Publication number 20230178445
    • Publication date Jun 8, 2023
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LARGE CAPACITY SOLID STATE BATTERY
    • Publication number 20230170532
    • Publication date Jun 1, 2023
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CARRIER WAFER WITH MULTIPLE ANTIREFLECTIVE COATING LAYERS
    • Publication number 20230087366
    • Publication date Mar 23, 2023
    • International Business Machines Corporation
    • Qianwen Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP
    • Publication number 20230051337
    • Publication date Feb 16, 2023
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
    • Publication number 20220384412
    • Publication date Dec 1, 2022
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNDERFILL INJECTION FOR ELECTRONIC DEVICES
    • Publication number 20220238403
    • Publication date Jul 28, 2022
    • International Business Machines Corporation
    • AKIHIRO HORIBE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...
    • Publication number 20210343545
    • Publication date Nov 4, 2021
    • International Business Machines Corporation
    • Keishi Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLID-STATE THIN FILM BATTERY FOR MICROCOMPUTING DEVICES
    • Publication number 20210320335
    • Publication date Oct 14, 2021
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SAMPLING OF BREATH GAS
    • Publication number 20210239679
    • Publication date Aug 5, 2021
    • International Business Machines Corporation
    • Akihiro Horibe
    • G01 - MEASURING TESTING
  • Information Patent Application

    STACKED DEVICE STRUCTURE
    • Publication number 20200358087
    • Publication date Nov 12, 2020
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRON DEVICE STACK STRUCTURE
    • Publication number 20200176821
    • Publication date Jun 4, 2020
    • International Business Machines Corporation
    • Kuniaki Sueoka
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...
    • Publication number 20200098592
    • Publication date Mar 26, 2020
    • International Business Machines Corporation
    • Keishi Okamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED FILM BATTERY ARCHITECTURE
    • Publication number 20190305355
    • Publication date Oct 3, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED FILM BATTERY ARCHITECTURE
    • Publication number 20190296387
    • Publication date Sep 26, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDUCTION OF STRESS IN VIA STRUCTURE
    • Publication number 20190214339
    • Publication date Jul 11, 2019
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS
    • Publication number 20190139840
    • Publication date May 9, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS
    • Publication number 20190103327
    • Publication date Apr 4, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS
    • Publication number 20190103328
    • Publication date Apr 4, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SINGLE-MODE POLYMER WAVEGUIDE CONNECTOR ASSEMBLY
    • Publication number 20190072721
    • Publication date Mar 7, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    SINGLE-MODE POLYMER WAVEGUIDE CONNECTOR ASSEMBLY
    • Publication number 20190072722
    • Publication date Mar 7, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE
    • Publication number 20190051603
    • Publication date Feb 14, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LARGE CAPACITY SOLID STATE BATTERY
    • Publication number 20190051943
    • Publication date Feb 14, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LARGE CAPACITY SOLID STATE BATTERY
    • Publication number 20190051944
    • Publication date Feb 14, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH-DENSITY INTERCONNECTING ADHESIVE TAPE
    • Publication number 20190051605
    • Publication date Feb 14, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS