Akihiro Kubota

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Press punching method and apparatus for forming a plurality of thro...
- Patent number 6,877,408
- Issue date Apr 12, 2005
- Fujitsu Limited
- Akihiro Kubota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and heat sink used therein
- Patent number 5,929,513
- Issue date Jul 27, 1999
- Fujitsu Limited
- Yuichi Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved heat dissipation efficiency
- Patent number 5,834,831
- Issue date Nov 10, 1998
- Fujitsu Limited
- Akihiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number RE35109
- Issue date Dec 5, 1995
- Fujitsu Limited
- Akihiro Kubota
- 257 - Active solid-state devices
Information Patent Grant
Semiconductor device and a process for making same having improved...
- Patent number 5,343,615
- Issue date Sep 6, 1994
- Fujitsu Limited
- Michio Sono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wire-bonding an integrated circuit
- Patent number 5,226,582
- Issue date Jul 13, 1993
- Fujitsu Limited
- Akihiro Kubota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin tablet for plastic encapsulation and method of manufacturing...
- Patent number 5,043,199
- Issue date Aug 27, 1991
- Fujitsu Limited
- Akihiro Kubota
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 4,984,059
- Issue date Jan 8, 1991
- Fujitsu Limited
- Akihiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High packing density lead frame and integrated circuit
- Patent number 4,801,997
- Issue date Jan 31, 1989
- Fujitsu Limited
- Michio Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-molded semiconductor device
- Patent number 4,698,660
- Issue date Oct 6, 1987
- Fujitsu Limited
- Akihiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Press punching method and apparatus for forming a plurality of thro...
- Publication number 20020002887
- Publication date Jan 10, 2002
- FUJITSU LIMITED
- Akihiro Kubota
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Akihiro Kubota

Person

Patents Grantslast 30 patents

Press punching method and apparatus for forming a plurality of thro...

Semiconductor device and heat sink used therein

Semiconductor device with improved heat dissipation efficiency

Semiconductor device and method for fabricating the same

Semiconductor device and a process for making same having improved...

Method for wire-bonding an integrated circuit

Resin tablet for plastic encapsulation and method of manufacturing...

Semiconductor device and a method for fabricating the same

High packing density lead frame and integrated circuit

Resin-molded semiconductor device

Patents Applicationslast 30 patents

Press punching method and apparatus for forming a plurality of thro...