Akihiro Miyazawa

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Okayama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 10,008,471
- Issue date Jun 26, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 9,240,256
- Issue date Jan 19, 2016
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Low-temperature-sinterable bonding material, and bonding method usi...
- Patent number 8,641,929
- Issue date Feb 4, 2014
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20160172328
- Publication date Jun 16, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20160136763
- Publication date May 19, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20160099087
- Publication date Apr 7, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USI...
- Publication number 20130081759
- Publication date Apr 4, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20120298009
- Publication date Nov 29, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR