Akihiro Nakayama

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Yokohama, Kanagawa-ken 236, JP

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Patents Grantslast 30 patents

Information Patent Grant
Slurry managing system and slurry managing method
- Patent number 6,161,533
- Issue date Dec 19, 2000
- Nippei Toyoma Corp.
- Noboru Katsumata
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slurry managing system and slurry managing method for wire saws
- Patent number 6,053,158
- Issue date Apr 25, 2000
- Nippei Toyoma Corp.
- Kensho Miyata
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer processing system
- Patent number 5,950,643
- Issue date Sep 14, 1999
- Takeshiro Miyazaki
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slurry managing system and slurry managing method for wire saws
- Patent number 5,799,643
- Issue date Sep 1, 1998
- Kensho Miyata
- B28 - WORKING CEMENT, CLAY, OR STONE