Akihiro Niimi

Person

Nagoya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with heat spreaders
- Patent number 8,421,235
- Issue date Apr 16, 2013
- Denso Corporation
- Shigeo Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic electrode forming method and semiconductor device having m...
- Patent number 7,910,460
- Issue date Mar 22, 2011
- Denso Corporation
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic electrode forming method and semiconductor device having m...
- Patent number 7,800,232
- Issue date Sep 21, 2010
- Denso Corporation
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing mold type semiconductor device
- Patent number 7,468,318
- Issue date Dec 23, 2008
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold type semiconductor device
- Patent number 7,193,326
- Issue date Mar 20, 2007
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package type semiconductor device
- Patent number 7,009,292
- Issue date Mar 7, 2006
- Denso Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120001341
- Publication date Jan 5, 2012
- DENSO CORPORATION
- Shigeo Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic electrode forming method and semiconductor device having m...
- Publication number 20100311191
- Publication date Dec 9, 2010
- DENSO CORPORATION
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic electrode forming method and semiconductor device having m...
- Publication number 20080217771
- Publication date Sep 11, 2008
- DENSO CORPORATION
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing mold type semiconductor device
- Publication number 20070158850
- Publication date Jul 12, 2007
- DENSO CORPORATION
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device including electrodes...
- Publication number 20050170555
- Publication date Aug 4, 2005
- DENSO Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package type semiconductor device
- Publication number 20050077599
- Publication date Apr 14, 2005
- DENSO Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold type semiconductor device and method for manufacturing the same
- Publication number 20040256730
- Publication date Dec 23, 2004
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS

Akihiro Niimi

Person

Patents Grantslast 30 patents

Semiconductor device with heat spreaders

Metallic electrode forming method and semiconductor device having m...

Metallic electrode forming method and semiconductor device having m...

Method for manufacturing mold type semiconductor device

Mold type semiconductor device

Package type semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Metallic electrode forming method and semiconductor device having m...

Metallic electrode forming method and semiconductor device having m...

Method for manufacturing mold type semiconductor device

Method of manufacturing a semiconductor device including electrodes...

Package type semiconductor device

Mold type semiconductor device and method for manufacturing the same