Akihiro TOBITA

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Kawasaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire to bonding pad
- Patent number 9,293,436
- Issue date Mar 22, 2016
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electrode/film opening edge spacing sma...
- Patent number 8,587,135
- Issue date Nov 19, 2013
- Renesas Electronics Corporation
- Tamaki Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,338,288
- Issue date Dec 25, 2012
- Renesas Electronics Corporation
- Tamaki Wada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20160197050
- Publication date Jul 7, 2016
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20150333030
- Publication date Nov 19, 2015
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Electrode/Film Opening Edge Spacing Sma...
- Publication number 20130075911
- Publication date Mar 28, 2013
- RENESAS ELECTRONICS CORPORATION
- Tamaki Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device
- Publication number 20110248406
- Publication date Oct 13, 2011
- RENESAS ELECTRONICS CORPORATION
- Tamaki WADA
- H01 - BASIC ELECTRIC ELEMENTS