Akihiro Yamamoto

Person

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for determining processing size of bonding mat...
- Patent number 7,195,682
- Issue date Mar 27, 2007
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressurizing method
- Patent number 7,076,867
- Issue date Jul 18, 2006
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming insulating film and method of fabricating semicon...
- Patent number 7,033,874
- Issue date Apr 25, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazuichiro Itonaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for determining processing size of bonding mat...
- Patent number 6,889,738
- Issue date May 10, 2005
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming insulating film and method of fabricating semicon...
- Patent number 6,800,512
- Issue date Oct 5, 2004
- Matsushita Electric Industrial Co., Ltd.
- Kazuichiro Itonaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding device and bump bonding method
- Patent number 6,481,616
- Issue date Nov 19, 2002
- Matsushita Electric Industrial Co. Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 6,474,538
- Issue date Nov 5, 2002
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component affixing method and apparatus
- Patent number 6,370,750
- Issue date Apr 16, 2002
- Matsushita Electric Industrial Co., Ltd.
- Nobuya Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding device and bump bonding method
- Patent number 6,328,196
- Issue date Dec 11, 2001
- Matsushita Electric Industrial Co., Ltd.
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,320,229
- Issue date Nov 20, 2001
- Matsushita Electronics Corporation
- Toshitaka Uchikoba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonding method and bump bonding apparatus
- Patent number 6,017,812
- Issue date Jan 25, 2000
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS capacitor and MOS capacitor fabrication method
- Patent number 5,973,381
- Issue date Oct 26, 1999
- Matsushita Electronics Corporation
- Chiaki Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump levelling method and bump levelling apparatus
- Patent number 5,899,140
- Issue date May 4, 1999
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonder with a discard bonding area
- Patent number 5,899,375
- Issue date May 4, 1999
- Matsushita Electric Industrial Co., Ltd.
- Koichi Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device for generating high voltage potentials
- Patent number 5,550,775
- Issue date Aug 27, 1996
- Matsushita Electronics Corporation
- Wataru Abe
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for packaging a semiconductor device having projected electr...
- Patent number 5,456,003
- Issue date Oct 10, 1995
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire clamping device and wire clamping method
- Patent number 5,314,175
- Issue date May 24, 1994
- Matsushita Electric Industrial Co., Ltd.
- Yasuo Izumi
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method for bonding semiconductor laser element and apparatus therefor
- Patent number 4,817,849
- Issue date Apr 4, 1989
- Matsushita Electric Industrial Co., Ltd.
- Akihiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for determining processing size of bonding mat...
- Publication number 20050098254
- Publication date May 12, 2005
- Akihiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming insulating film and method of fabricating semicon...
- Publication number 20040224450
- Publication date Nov 11, 2004
- Matsushita Electric Co., Ltd.
- Kazuichiro Itonaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for determining processing size of bonding mat...
- Publication number 20040069397
- Publication date Apr 15, 2004
- Akihiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pressurizing method and pressurizing apparatus
- Publication number 20030145459
- Publication date Aug 7, 2003
- Akihiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump bonding device and bump bonding method
- Publication number 20020030087
- Publication date Mar 14, 2002
- Makoto Imanishi
- H01 - BASIC ELECTRIC ELEMENTS

Akihiro Yamamoto

Person

Patents Grantslast 30 patents

Method and apparatus for determining processing size of bonding mat...

Pressurizing method

Method of forming insulating film and method of fabricating semicon...

Method and apparatus for determining processing size of bonding mat...

Method of forming insulating film and method of fabricating semicon...

Bump bonding device and bump bonding method

Bonding apparatus and bonding method

Component affixing method and apparatus

Bump bonding device and bump bonding method

Semiconductor device

Bump bonding method and bump bonding apparatus

MOS capacitor and MOS capacitor fabrication method

Bump levelling method and bump levelling apparatus

Bump bonder with a discard bonding area

Semiconductor device for generating high voltage potentials

Method for packaging a semiconductor device having projected electr...

Wire clamping device and wire clamping method

Method for bonding semiconductor laser element and apparatus therefor

Patents Applicationslast 30 patents

Method and apparatus for determining processing size of bonding mat...

Method of forming insulating film and method of fabricating semicon...

Method and apparatus for determining processing size of bonding mat...

Pressurizing method and pressurizing apparatus

Bump bonding device and bump bonding method