Akihiro Yoshino

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Aichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding aid for polyamide resin and method of bonding with the same
- Patent number 7,588,659
- Issue date Sep 15, 2009
- Kabushiki Kaisha Katazen
- Akihiro Yoshino
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Bonding aid for polyamide resin and method of bonding with the same
- Publication number 20060084788
- Publication date Apr 20, 2006
- Akihiro Yoshino
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...