Akihisa KUROYANAGI

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Fan-out semiconductor package
- Patent number 11,195,790
- Issue date Dec 7, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Akihisa Kuroyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including organic interposer
- Patent number 10,854,528
- Issue date Dec 1, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package with electromagnetic wave shielding
- Patent number 10,692,791
- Issue date Jun 23, 2020
- Samsung Electronics Co., Ltd.
- Akihisa Kuroyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including organic interposer
- Patent number 10,541,187
- Issue date Jan 21, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,504,836
- Issue date Dec 10, 2019
- Samsung Electronics Co., Ltd.
- Akihisa Kuroyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package module
- Patent number 10,475,776
- Issue date Nov 12, 2019
- Samsung Electronics Co., Ltd.
- Yeong A Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER
- Publication number 20200152538
- Publication date May 14, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20200083163
- Publication date Mar 12, 2020
- Samsung Electronics Co., Ltd.
- Akihisa KUROYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20190371692
- Publication date Dec 5, 2019
- Samsung Electronics Co., Ltd.
- Akihisa KUROYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190252311
- Publication date Aug 15, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Akihisa KUROYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER
- Publication number 20190139851
- Publication date May 9, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jun Woo MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE MODULE
- Publication number 20190131285
- Publication date May 2, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yeong A KIM
- H01 - BASIC ELECTRIC ELEMENTS